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Course Overview The first part of the course covers a short overview of semiconductor design and fabrication steps such as IC design techniques, wafer processing, assembly and packaging. Semiconductor jargon … Continue reading "Seminar: Understanding Semiconductor Technology & Business" |
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Explore the show floor Companies offer an inside look into their portfolio of products and services. Find top suppliers, explore product and company capabilities, and build partnerships that will advance … 
The Must Attend Event for Chip, Board, and Systems Design Engineers DesignCon is the premier high-speed communications and system design conference and exposition, offering industry-critical engineering education in the heart … Course Overview The purpose of this course is to provide a comprehensive understanding of the semiconductor industry and the manufacturing process of an integrated circuit for new personnel entering the … Continue reading "Seminar: Overview of Semiconductor Manufacturing" |
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The Evolution of Advanced Packaging The evolution of Advanced Package Technology is experiencing substantial changes as system designs directly drive package performance requirements. The Wafer-Level Packaging Symposium brings together the industry's foremost experts to examine all aspects of wafer and panel-level packaging, 3D device packaging, advanced manufacturing, and testing technologies. REGISTER HERE |
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ISSCC 2027 ISSCC 2027 will be held February 14-18, 2027 at the San Francisco Marriott Marquis and features an exhibition space for companies and research institutions to showcase their work. About ISSCC The International Solid-State Circuits Conference is the foremost global forum for presentation of advances in solid-state circuits and systems-on-a-chip. The Conference offers a … Continue reading "2027 IEEE International Solid-State Circuits Conference (ISSCC)" |
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RISC-V Summit North America 2027 is taking place from February 16 to 18 at the Hyatt Regency, Embarcadero in San Francisco, California. February 16 is Member Day and the main conference will begin on February 17. RISC-V is defining the future of open computing by providing unprecedented freedom to innovate. SHD Group estimates a RISC-V … |
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Highlights Global Supply Chain Over 550 semiconductor companies from around the world will participate with 2,409 booths, welcoming 70,000 attendees. Keynote Speech Leaders in the semiconductor industry will provide valuable insights for the future. Tech Conferences At 30 technology programs, 200 visionaries will share the most noteworthy tech trends shaping the industry. Business Programs Investment …
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The Phil Kaufman Award honors individuals who have had a demonstrable impact on the field of electronic system design through technology innovations, education/mentoring, or business or industry leadership. The award was established as a tribute to Phil Kaufman, the late industry pioneer who turned innovative technologies into commercial businesses that have benefited electronic designers. Time 6:30 … |
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Connect with the semiconductor community The exhibition at Advanced Lithography + Patterning is where people gather to collaborate and get business done. Find these technology solutions and more: • Photoresist, EUV, and other specialty materials • E-beam lithography systems • Precision cleaning, contamination, transport support materials • Wafer treatments and substrates REGISTER HERE |
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Course Overview The first part of the course covers a short overview of semiconductor design and fabrication steps such as IC design techniques, wafer processing, assembly and packaging. Semiconductor jargon such as process nodes, high and low-k materials, various types of substrates such as Si, SiGe, FDSOI, GaAs. Discuss various types of transistors such as … Continue reading "Virtual Training: Understanding Semiconductor Technology & Business" |
2 events,Course Overview The purpose of this course is to provide a comprehensive understanding of the semiconductor industry and the manufacturing process of an integrated circuit for new personnel entering the field or individuals looking for a well-rounded understanding of all the jargon, tools, and materials used in the process. What the Course Covers Basic Electronics … Continue reading "Virtual Seminar – Overview of Semiconductor Manufacturing – Europe" |
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ADVANCED PACKAGING FOR SCALABLE AI: CONNECTING COMPUTE, MEMORY, POWER AND PHOTONICS Sheraton Grand at Wild Horse Pass Phoenix, Arizona March 1-4, 2027 The 23rd Annual IMAPS Device Packaging Conference (DPC 2027) will be held in Phoenix, Arizona, on March 1-4, 2027. It is an international event organized by the International Microelectronics Assembly and Packaging Society … 
Experience the power of connection MWC27 Barcelona brings together the world’s leading connectivity ecosystem, creating opportunities to meet customers, build partnerships and discover the technologies shaping industries worldwide. Join over 100,000 decision makers in Barcelona. 1 - 4 March, 2027 Fira Gran Via, Barcelona Turn conversations into customers at MWC27 Join the companies leading connectivity … 
DVCon is the premier conference on the application of languages, tools, and methodologies for the design and verification of electronic systems and integrated circuits. The focus of the conference is the usage of specialized design and verification languages such as SystemVerilog, Verilog, VHDL, PSS, SystemC and e, as well as general purpose languages such as … |
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