ADVANCED PACKAGING FOR SCALABLE AI: CONNECTING COMPUTE, MEMORY, POWER AND PHOTONICS Sheraton Grand at Wild Horse Pass Phoenix, Arizona March 1-4, 2027 The 23rd Annual IMAPS Device Packaging Conference (DPC 2027) will be held in Phoenix, Arizona, on March 1-4, 2027. It is an international event organized by the International Microelectronics Assembly and Packaging Society …
