Wednesday, May 21 - 8:00 AM Pacific The semiconductor industry faces a critical Verification Productivity Gap 2.0, driven by increasingly complex technologies including 3DICs, chiplet-based designs, and software-defined architectures. This …
Date: May 21, 2025 | 10:00 AM PDT Featured Speakers: Nitin Navale, Principal Member of Technical Staff, AMD Amlendu Choubey, Sr. Director, Product Management, Synopsys Why You Should Attend: With the rising demand for highly efficient 3DIC design and performance, it’s crucial to understand the IR and thermal landscape of a product as early as possible in the design …
Webinar Content Dive into the world of evaluating Large Language Model (LLM) agents with a focus on practical insights and actionable strategies. This webinar will cover key evaluation metrics and …
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Ray tracing is at the heart of optical design, enabling engineers to analyze and optimize the performance of optical systems across diverse applications. This webinar will explore how Ansys Zemax …
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Event Highlights As a part of the Simulation World 2025 event series, this event offers expert-led sessions, real-world success stories, and valuable insights into the Ansys simulation strategy. Hear from leading …
Join the ESD Alliance for an informative evening of networking, presentations, and a panel! Time 5:30 pm - 8:30 pm PDT How Multi-Physics is Reshaping Chip Design and EDA Tools …
The 30th IEEE European Test Symposium (ETS) is Europe's premier forum dedicated to presenting and discussing scientific results, emerging ideas, hot topics and new trends, as well as industrial case-studies and …
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About ECTC The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. ECTC is sponsored by the IEEE Electronics Packaging Society. The technical program contains papers covering leading edge developments …
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Overview VIRTUAL EVENT Join us for this virtual event showcasing the advancements in Stray Light Analysis for high-precision optical systems. Stray light can degrade image quality, reduce system performance, and …
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Join us to get the latest on: TSMC's industry-leading HPC, Smartphone, IoT, and Automotive platform solutions to advance the AI future TSMC’s advanced logic technology progress on 5nm, 4nm, 3nm, …
Simulation plays a critical role in reducing automotive design cycles, providing key insights into design changes and optimizations before a single physical prototype is built. As automotive time-to-market demands shorten …
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Wednesday, May 28 - 8:00 AM Pacific Managing traceability across multiple disconnected tools and data is a challenge that often leads to inefficiencies, missed coverage, and increased risk in safety-critical …
