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Semiconductor packaging is a critical step in the development of modern electronic devices, influencing their performance, reliability, and thermal management. The complexity of packaging technologies has grown significantly with the demand for miniaturization, higher power densities, and improved mechanical and thermal robustness. Addressing these challenges requires a comprehensive understanding of the multiphysics interactions within semiconductor …
Gaylord National Resort & Convention Center
Forest Heights, MD, United States
Powered by the Navy League of the United States, Sea-Air-Space is the premier maritime exposition in the U.S., bringing together defense industry leaders and top military decision-makers from around the …
CONNECTING THE CS INDUSTRY The 15th CS International builds on the strengths of its predecessors, with around 40 leaders from industry and academia delivering presentations that fall within five key …
Seattle Convention Center
705 Pike Street, Seattle, WA, United States
See you in Seattle! Time and time again, multidisciplinary research is touted as essential to innovation. That is why, from April 7-11, 2025, researchers working in seemingly unrelated fields will …
About the Event The 5th ICA Summit 2025 is a premier international conference and exhibition in Autonomous and Connected Mobility. With a successful track record in Munich and Frankfurt, our event has grown …
Key Insights on AI, EVs, and Semiconductor Trends The automotive industry has long evolved gradually—but 2024 proved to be anything but typical. With major automaker CEOs resigning and suppliers facing …
How Embedded Data Management in Cadence Virtuoso Studio Supercharges Analog Design Join us on April 8 to discover how to unlock the power of built-in data management using Keysight Design …
This webinar explores the role of electromagnetic simulation in IoT using Ansys solutions, highlighting cost reduction, reliability, and accelerated design through virtual testing before prototyping. The webinar will be presented …
As hyperscaler chiplet and SoCs grow in complexity, integrating and validating multiple high-speed and low-speed interface protocols—such as PCIe, CXL, UCIe, AMBA, AXI, AHB, CHI, CSI2, and DSI2, can be …
As hyperscaler chiplet and SoCs grow in complexity, integrating and validating multiple high-speed and low-speed interface protocols—such as PCIe, CXL, UCIe, AMBA, AXI, AHB, CHI, CSI2, and DSI2, can be …
Today’s AI designs stress verification teams to an unprecedented extent. The compound complexity from software, hardware, interfaces, and architecture options leads to the challenge of running quadrillions of verification cycles …
Join us on April 9 to discover how to unlock the power of built-in data management using Keysight Design Data Management (SOS) within Cadence Virtuoso Studio. Here’s What You Can …
