Chiplet and heterogeneous integration of packaging has been embraced as the next revolutionary innovation to meet the quest of size, cost, and performance for packaging. The technologies are seen as another disruptive technology to bring devices into a package by integrating the various Multi-chip module (MCM), 3D packaging, Through Silicon Via (TSV), and Fan-out wafer …
Connecting the Synopsys User Community Since 1991, the Synopsys Users Group (SNUG) has represented a global design community focused on innovating from Silicon to Systems. Today, as the electronics industry’s largest user conference, SNUG brings together over 12,000 Synopsys tool and technology users across North America, Europe, Asia, and Japan. In addition to peer-reviewed technical …
Are you driving design change? Do you think you have successfully overcome challenges that may affect the electronic revolution? CadenceLIVE is willing to provide a platform to share your story. …
Join us for a webinar that will explore the role of SEMI’s Public Policy and Advocacy (PP&A) team in driving policy developments that are relevant to the ESDA community. PP&A …
The Design & Verification Conference & Exhibition is the premier conference on the application of languages, tools, methodologies and standards for the design and verification of electronic systems and integrated …
Penang has been a significant player in the semiconductor industry, supplying 20% of the semiconductor products imported by the US as of February 2023. The region is often referred to …
Welcome to the 32nd iteration of the IEEE Hot Interconnects symposium. HotI’2025 will be held virtually. 2025 Conference Theme - Interconnect Software: You can't touch it but you need it …
Designing DSP Applications with Versal AI Engines Workshop This workshop covers the AMD Versal AI Engine architecture and using the AI Engine DSP Library, system partitioning, rapid prototyping, and custom coding of AI Engine kernels. Developing AI Engine DSP designs using AMD Vitis Model Composer is also demonstrated. The emphasis of this course is on: Providing an …
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Hot Chips 2025 will be held Sunday, August 24 - Tuesday, August 26, 2025 at Memorial Auditorium, Stanford, Palo Alto, CA. About Since it started in 1989, HOT CHIPS has been known as one of the semiconductor industry’s leading conferences on high-performance microprocessors and related integrated circuits. The conference is held once a year in …
Embark on a journey through semiconductor design, manufacturing, and business in this illuminating course. Explore IC design techniques, transistor evolution, and market dynamics. Delve into substrate types and industry economics, discovering the fastest-growing markets and key players shaping the semiconductor landscape. Pricing Early Bird Special - $100 off until August 11th! Members: $845 $745 Non-Members: $945 $845 * For …
Connecting the Synopsys User Community Since 1991, the Synopsys Users Group (SNUG) has represented a global design community focused on innovating from Silicon to Systems. Today, as the electronics industry’s largest user conference, SNUG brings together over 12,000 Synopsys tool and technology users across North America, Europe, Asia, and Japan. In addition to peer-reviewed technical …
Gain a comprehensive understanding of the semiconductor industry and the integrated circuit (IC) manufacturing process. This course is designed for new personnel in the field or anyone seeking a well-rounded knowledge of the tools, materials, and terminology used in semiconductor manufacturing. Pricing Early Bird Special! $100 off until August 12th Members: $995 $895 Non-Members: $1,095 $995 * For group …
