Don't miss our upcoming webinar, where we'll explore the importance of safety in automotive design. This session will focus on the customer's high demand for integrated safety flows in verification, …
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Semiconductor and integrated circuit development continues to proceed at an incredible pace. The industry as a whole has gotten to this point of incredible complexity through the process of countless …
Fresh New Name. Same Great Event. Introducing MD&M West Previously known as Informa Markets Engineering (IME) West, hosting five co-located shows — MD&M West, ATX West, D&M West, Plastec West, …
Join Comer Industries and Asotech in this webinar to see how Ansys simulations optimize gearbox durability and performance. DATE / TIME: February 4, 2025 10 AM EST / 4 PM …
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Package reliability and qualification continue to evolve with the electronics industry. New electronics applications require new approaches to reliability and qualification. In the past, reliability meant discovering, characterizing and modeling …
Historically, PCB power distribution networks (PDNs) have been designed based on rules of thumb, such as “put a 0.1uF decoupling cap down for every power pin on the device”. These …
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About this event Modern devices' growing complexity and the semiconductor industry's domain-specific nature have made intellectual property (IP) management essential. This webinar explores how Allegro Microsystems, a global leader in …
Creating custom blocks in Virtuoso using today's advanced technology nodes becomes even more complex due to the vast number of design rules. Invoking a typical GUI to launch multiple DRC …
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About this event Thank you to our sponsors, Synopsys and Cadence The Trends in System Design event, hosted by DESN in Reading on February 6th, will be open to both …
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Cutting Edge Advancements in 5G and 6G Technology Join us for a complimentary seminar and networking event on the latest advanced 5G and 6G technology! Our experts will provide updates …
Integrated Circuit packaging has always been integral to IC performance and functionality. An IC package serves many purposes: 1) pitch conversion between the fine features of the IC die and the system level interconnection; 2) chemical, environmental and mechanical protection; 3) heat transfer; 4) power, ground and signal distribution between the die and system; 5) …
Why You Should Attend Optimizing power is no longer optional—it's critical for advanced designs. This seminar will provide cutting-edge insights and practical methodologies to: Design efficient, low-power architectures Accurately analyze …
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