Join us for a new approach to designing lumped-element filters and discover how easy such design can be while achieving the desired accuracy. TIME: January 28, 2025 11 AM EDT / 5 PM CET Venue: Virtual Overview Streamline the design of lumped-element and planar filters with Ansys Nuhertz Filter Solutions. For lumped-element filters, one approach …
Engineers solve today’s challenges by leveraging simulation, and the Technical University of Madrid (UPM) addresses this need with its Master’s Degree in Numerical Simulation. Developed in collaboration with Ansys, the program equips engineers to bridge the industry's skills gap by fostering a deep understanding of numerical simulation methods. It emphasizes practical applications and best practices …
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Theme: Mixed Signal Verification Analog mixed signal chips continue to grow in both demand and complexity, and a consistent efficient verification approach remains a key topic for concern. This DVClub will be held at the Futures Institute at the University of Edinburgh and the university students will be attending. The first half of the DVClub will …
Breakthroughs in photonics: network and innovate with leading experts and industrial players Why you should attend CEA-Leti leverages advances in semiconductors to enable far-reaching changes in photonic technologies. Join us to discover how breakthroughs in photonics can boost your innovation process. CEA-Leti experts will present cutting-edge results for the future of photonics-based applications (Displays, Optical …
Semiconductor and integrated circuit development continues to proceed at an incredible pace. The industry as a whole has gotten to this point of incredible complexity through the process of countless …
Fresh New Name. Same Great Event. Introducing MD&M West Previously known as Informa Markets Engineering (IME) West, hosting five co-located shows — MD&M West, ATX West, D&M West, Plastec West, …
Join Comer Industries and Asotech in this webinar to see how Ansys simulations optimize gearbox durability and performance. DATE / TIME: February 4, 2025 10 AM EST / 4 PM …
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Package reliability and qualification continue to evolve with the electronics industry. New electronics applications require new approaches to reliability and qualification. In the past, reliability meant discovering, characterizing and modeling …
Integrated Circuit packaging has always been integral to IC performance and functionality. An IC package serves many purposes: 1) pitch conversion between the fine features of the IC die and …
Join us on February 13th for an in-depth look into how optical sensors are revolutionizing health monitoring in wearable devices, offering unprecedented accuracy and functionality for real-time physiological assessments. TIME: February …
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About ISSCC The International Solid-State Circuits Conference is the foremost global forum for presentation of advances in solid-state circuits and systems-on-a-chip. The Conference offers a unique opportunity for engineers working …
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Thank you to those who attended and participated in the 2024 SMTA Wafer-Level Packaging Symposium! Their presence contributed to the success of this event, and we are truly thankful for …
