THE CONFERENCE The first European Solid-State Device Research Conference (ESSDERC) conference was organized in 1971 in Munich, Germany, aiming to present the latest developments in physics, technology and characterization of …
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The only full-stack AI & ML infrastructure event The AI Hardware & Edge AI Summit is rebranding to the AI Infra Summit to create the first comprehensive, full-stack AI Infrastructure conference, arranged in a modular way that equally enables both enterprises and technology/solution providers to benefit from domain-specific content, all while doing business on the exhibition floor. Topics covered: Hardware …
Providing a Pivotal Platform for the Global Defence Industry. DSEI is a pivotal event for the global defence industry. As the flagship defence event for the UK, DSEI promotes the UK’s defence ethos, agenda and leadership while encouraging opportunity and cooperation with our global allies. The world’s leading defence organisations and most influential stakeholders …
Leading with Collaboration. Innovating with the World. SEMICON Taiwan 2025 will take place from September 10–12, 2025 at the Taipei Nangang Exhibition Center! This year’s exhibition will bring together over 1,100 leading semiconductor and technology companies, with more than 4,000 booths and an expected attendance of over 100,000 industry professionals, making it one of the …
Connecting the data center ecosystem to design, build & operate sustainable data centers for the AI age Bringing together more than 4,000 senior leaders working on Europe's largest data center projects, DCD>Connect | London will drive industry collaboration, help you forge new partnerships and identify innovative solutions to your core challenges. "First class event that …
SAE International's COMVEC™ serves as the premier event, or perhaps, ecosystem where global leaders from the on-highway, off-highway, and defense sectors come together in a neutral setting to collaborate on …
EMPC 2025 is the 25th European Microelectronics & Packaging Conference, an international event for microelectronics packaging, assembly, and interconnection technologies, taking place in Grenoble, France, from September 16–18, 2025. The conference …
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Join us for an in-person seminar to explore the future of custom design and migration with AI-powered Virtuoso Studio. Discover how the latest innovations from Cadence are transforming analog, custom, …
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Functional ECO (Engineering Change Order) continues to pose a persistent challenge for ASIC designers. To address this, Easy-Logic Technology, in collaboration with SemiWiki, is launching a webinar series focused on …
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Date: Tuesday, September 16, 2025 Time: 10:00 BST / 11:00 CEST / 12:00 EEST / 14:30 IST In the high-stakes world of aerospace and defense (A&D), engineers face mounting challenges in designing …
This webinar explores strategies for optimizing SMT filter designs, addressing spurious responses, parasitic behaviors, and PCB layout challenges using Cadence’s Microwave Office and Modelithics simulation models to ensure accurate and …
SICAM EPMS the future proven Solution for Power Management in Data Center This webinar is designed for technical engineers tasked with defining and implementing solutions for power management, power monitoring, …
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