Register for CadenceTECHTALK to find out how to achieve verification closure with the same coverage with up to a 10X reduction in simulation cycles. Chips are becoming bigger and more …
Continue reading "Webinar: Find More Bugs, Hit the Most Difficult Scenarios Faster"
Crack the Verification Double Trouble! Register for CadenceTECHTALK to find out how to achieve verification closure with the same coverage with up to a 10X reduction in simulation cycles. Chips …
Continue reading "CadenceTECHTALK: Find Elusive Bugs Faster with Xcelium ML"
Ansys Speos pushes the innovation envelope to deliver accurate, high-performance simulation capabilities for optics designers. The 2023 R1 Release delivers powerful capabilities that speed time to result, improve simulation accuracy, …
Continue reading "Webinar: Ansys 2023 R1: Ansys Speos What’s New"
Day 1 (February 1, 2023) of this workshop series will cover practical knowledge of the best datapath verification strategies and provide hands-on experience with the industry's best-in-class datapath validation app – Synopsys VC Formal DPV. This workshop includes a featured session presented by Theo Drane, Datapath Architect at Intel, who will share his experience on how …
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This webinar will discuss the benefits of a multiphysics approach to electric motor design and explore different simulation solutions. We’ll share relevant examples and case studies with electric motor design …
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Thermal signature modelling is one of the most challenging steps on the EOIR mission simulation thread; depending on the materials it's made of and the heat loads a target is …
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The 2023 R1 release of Minerva improves engineering productivity with an efficient simulation process, data management, and an easier way to manage data across tasks performed by development teams. Register …
Continue reading "Ansys 2023 R1: Ansys Minerva and Simulation Process Data Management (SPDM) Update"
Making better-informed material choices early in design is ideal for solving various engineering challenges. This upcoming webinar looks at the tradeoff between different material properties and the technical, economic, and …
Continue reading "Webinar: Five Challenges you Can Solve with Better Material Selection"
Next-generation devices increasingly feature complex architectures that connect dies vertically (3D IC) or side-by-side (2.5D) so they behave as a single device. The new Tessent Multi-die software delivers comprehensive automation …
Continue reading "Webinar: Implementing DFT in 2.5/3D designs using Tessent Multi-die software"
The ever-increasing need for faster, smaller, and multi-tasking electronic devices poses a significant thermal management challenge for the processor and the system. Manufacturers need to strike a good balance between …
Continue reading "Webinar: Dynamic Thermal Management Using AEDT Icepak"
Learn about the latest updates and functionality in Ansys Zemax OpticStudio and Ansys Zemax OpticsBuilder in this upcoming webinar. This 2023 R1 Release includes the Composite Surface (CS) property, allowing …
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Join this webinar to get introduced to the latest PyAnsys package, “PyTwin,” giving easy access to the power of Ansys Digital Twins Runtimes through Python APIs. TIME: FEBRUARY 14, 2023 …
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