The OCP Summit is the premier event uniting the most forward-thinking minds in open IT Ecosystem development. The Summit presents a unique platform for our Community from around the globe to …
ABOUT PAINE Physical inspection of electronics has grown significantly over the past decade and is becoming a major focus for the chip designers, original equipment manufacturers, and system developers. The complex long life of the electronic devices coupled with their diverse applications is making them increasingly vulnerable to various forms of threats and inspection. Large …
Andes RISC-V CON Munich Smartvillage Bogenhausen REGISTER HERE
October 15, 2025 - 11:00 AM EST October 16, 2025 – 10:00 AM JST/KST Discover the 5 Critical AI Market Trends Reshaping Semiconductors in 2026 From datacenter accelerators to 2nm …
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Date: Oct 15, 2025 | 5:00 PM PST Featured Speakers: Saurabh Suryavanshi, Product Manager, Synopsys Youngkwon Cho, Senior Staff Engineer, Synopsys Dipanjan Basu, Principal Engineer, Synopsys Calibration is an essential part of enabling TCAD …
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Conference Profile The embedded world China Conference will take place on October 16 and 17, 2025 at the Shanghai World Expo Exhibition and Convention Centre. The main topics of this …
The IEEE/ACM International Symposium on Microarchitecture® is the premier forum for presenting, discussing, and debating innovative microarchitecture ideas and techniques for advanced computing and communication systems. This symposium brings together researchers in …
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Join colleagues at the largest optical manufacturing conference and exhibition in North America SPIE Optifab is the premier event to meet with top companies and learn about the latest optical …
The National Institute of Standards and Technology (NIST) will host the Semiconductor Traceability and Provenance Workshop on Tuesday, October 21, 2025, at its campus in Gaithersburg, Maryland. This in-person, one-day …
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RISC-V is defining the future of open computing by providing unprecedented freedom to innovate. More than 13 billion RISC-V cores have shipped, powering new innovations in AI/ML, wireless, automotive, data …
Event Summary The year 2025 is both a turning point for integrated photonics as a key enabler for AI, physical and infrastructure interconnect, and the International Year of Quantum (IYQ). …
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Webinar date: 22.10.2025 | 9 AM CEST | 5 PM CEST Join our webinar and learn about the fundamentals of Gallium Nitride (GaN) technology and its applications in power systems. …
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Achieving Timing Closure in FPGA Designs Workshop Do you find it challenging to close timing in your FPGA design? This workshop will guide you through leveraging AMD Vivado’s tools, optimizing your design, …
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October 22, 2025 - 11:00 AM EST October 23, 2025 – 10:00 AM JST/KST Discover the 5 Critical Power Market Trends Reshaping Semiconductors in 2026 Wide-bandgap disruption, PMIC innovation, and …
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Europe's Role & Chips Act 2.0 Priorities The European Union is currently developing a new version of the Chips Act program. The European Chips Act 2.0 represents a strategic initiative …
*Work Email Required* Edge AI systems increasingly require on-chip integration of large-capacity memory, compute engines, and inference-optimized accelerators—all within strict power, latency, and footprint constraints. This webinar provides a an overview of IP architecture and integration methodologies that support real-time AI workloads at the edge. We’ll cover: • Memory and compute efficiency: Techniques for optimizing …
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Join us for the 2025 TSMC OIP ECOSYSTEM FORUM Get ready for an electrifying dive into the future of semiconductor design at the 2025 TSMC Global Open Innovation Platform® (OIP) Ecosystem …
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The 2025 International Conference on Computer-Aided Design Call For Papers Jointly sponsored by IEEE and ACM, IEEE ICCAD is the premier forum to explore new challenges, present leading-edge innovative solutions, …
The increasing demand for accelerated computing solutions calls for an agile hardware design methodology to be able to keep up with fast evolving landscape of algorithms. Traditional hardware design methodology has long development cycles involving defining architecture, doing microarchitecture development using RTL, and performing verification. An agile workflow requires being able to iterate through the …
CadenceCONNECT: Jasper User Group 2025 is October 29 and 30 in San Jose, CA. This interactive, in-depth technical conference connects designers, verification engineers, and engineering managers from around the world …
As digital chip design complexity grows, engineering teams face increasing pressure to meet aggressive PPA targets on tight schedules. To overcome this challenge, the EDA industry requires a revolutionary shift towards AI. Siemens EDA is leading this transformation by implementing a comprehensive strategy that combines machine learning, reinforcement learning, generative, and agentic AI across the …
Description BLT, an AMD Premier Design Services Partner and Authorized Training Provider, presents this webinar. Unlock the potential of the AMD Kria SOM and discover Time-Sensitive Networking (TSN) benefits for your applications. In this session, you’ll explore the TSN-ROS application and its role in enhancing communications within a TSN framework. Join our hands-on demonstration to …
October 29, 2025 - 11:00 AM EST October 30, 2025 – 10:00 AM JST/KST Discover the 5 Critical Memory Market Trends Reshaping Semiconductors in 2026 AI workloads, HBM4 adoption, and 3D NAND scaling—what’s next for the memory industry in 2026. The memory semiconductor industry is entering a critical inflection point. Explosive AI workloads are pushing …
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Semiconductor and integrated circuit developments continue to proceed at an incredible pace. The industry as a whole has gotten to this point of incredible complexity through the process of countless …
