We are excited to announce the 30th Automobil-Elektronik Kongress, set to take place on June 16 and 17, 2026 at the Forum am Schlosspark in Ludwigsburg, Germany. This prestigious technical conference will bring together industry experts, researchers, and innovators to discuss the latest advancements in automotive electronics. Join us to stay at the forefront of innovation …
**Work Email Required for Registration** Embedded systems programs rarely fail because any one team lacks capability. They fail because critical engineering artifacts drift out of alignment over time and distance. This includes requirements, architecture, implementation, verification, hardware bring-up, firmware, and customer documentation. Local correctness does not guarantee lifecycle coherence. llmda.ai believes that consistency itself should …
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About this event The Inference Stack Can Talk. Learn How to Listen. AI has entered the inference era. For years the industry focused on training models. But today the real challenge is running AI workloads in production at scale. In this webinar, you’ll have the opportunity to learn how to decode the signals from your inference stack and turn them into smarter infrastructure …
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Themed Heterogeneous Integration: Bolstering Europe's Resilience the 3D & Systems Summit 2025 will primarily focus on exploring strategies for enhancing Europe's semiconductor industry addressing topics as geopolitical dynamics, market trends, as well as the latest advancements in chiplet applications and hybrid bonding techniques. The Summit will feature an exclusive exhibition area, showcasing industry leaders alongside innovative emerging …
About this event This webinar showcases how the Keysight Technologies SOS extension integrates design data management directly into Visual Studio Code, helping digital design and verification teams streamline RTL and HDL workflows without leaving their coding environment. Who should attend this event? Digital design engineers writing RTL in SystemVerilog, Verilog, or VHDL who use VS Code …
CONFERENCE & EXHIBITION HPC, AI, Quantum: Powering Innovation and Sustainability ISC 2026 connects scientists, engineers, and technology leaders to explore the future of high performance computing. We will examine today’s breakthroughs in artificial intelligence, high performance computing and quantum technologies, as well as what lies ahead. Additionally, we are committed to sustainability by promoting energy-efficient …
Verification Futures UK 2026, co-located with Semiconductors Futures 2026 organised by Tessolve and co-organised this year with Alpinum. The conference continues its strong tradition of delivering a unique blend of conference presentations, exhibitions, training, and industry networking sessions focused on the challenges faced in hardware and software verification. The event remains an important forum for …
CEA-Leti’s flagship event Discover sustainable semiconductor breakthroughs to guide your roadmap from lab-to-market and to tomorrow’s AI factory at LID World Summit 2026. Join industry leaders to discover groundbreaking innovation that will help meet technological goals for the healthcare, automotive, industrial, defense, and consumer-electronics sectors. Leave with confidence in the possible. REGISTER HERE
About this event This webinar shows how engineers can use a unified EOE simulation workflow in Keysight Advanced Design System (ADS) to co-design and validate high-speed Ethernet systems across both electronic and photonic domains for faster, more accurate development. Who should attend this event? Signal integrity engineers working on high-speed Ethernet links, Photonic design engineers …
Join us for our 6th Annual Virtual Prototyping Day and learn how you can "shift left" your development cycle with virtual prototypes. Highly complex SoC and muti-die designs are putting pressure on silicon and software development teams to meet time-to-market demands. Virtual prototypes are the answer to begin development earlier, reduce costs, collaborate across teams, and …
Date: Jun 25, 2026 | 9:00 AM PST In this webinar, Intel will present how EMIB (Embedded Multi‑die Interconnect Bridge) enables compact, cost-effective multi‑die design while sustaining the bandwidth and power efficiency required for AI and datacenter designs. Intel will share an EMIB reference methodology built on Synopsys 3DIC Compiler platform that spans early planning through signoff. The webinar …
Join us to get the latest on: TSMC’s industry-leading HPC, Smartphones, IoT, and Automotive platform solutions TSMC’s advanced logic technology progress on 3nm, 2nm, A16, A14 processes and beyond TSMC 3DFabric® advanced silicon stacking and packaging technology advancement on TSMC-SoIC®, InFO, CoWoS®, and TSMC-SoW™ TSMC’s specialty technology breakthroughs on ultra-low power, RF, embedded memory, power management, …
About this event Engineering at the Edge Webinar Series - Episode 4 As semiconductor complexity increases and board designs become denser, manufacturing teams face tighter tolerances, reduced test access, and rising pressure to maintain yield and throughput. Validating RF performance and high-speed digital signal integrity at production scale adds a new layer of complexity that …
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Tutorial Abstract Since the invention of the 1T1C bit cell more than 50 years ago, DRAMs have become the main memory of choice for processors in computing systems and consumer electronics devices. As new computing paradigms have been created, including AI, 3D graphics, HPC, cloud computing, and smart phones, specialized processors and DRAM memories have …
The International Symposium on Computer Architecture (ISCA) is the premier forum for new ideas and experimental results in computer architecture. The conference specifically seeks particularly forward-looking and novel submissions. In 2026, the 53rd edition of ISCA will be held in Raleigh at the Raleigh Convention Center from June 27 to July 1, 2026. REGISTER HERE
Overview The AVS 26th International Conference on Atomic Layer Deposition (ALD 2026) featuring the 13th International Atomic Layer Etching Workshop (ALE 2026) will be a three-day meeting dedicated to the science and technology of atomic layer controlled deposition of thin films and atomic layer etching. Since 2001, the ALD conference has been held alternately in the United States, Europe …
Join us in 2026 We are ready to deliver more 1,800+ attendees. Join our community of users, industry experts and trusted partners. Realize LIVE offers something for everyone! 350+ sessions. Explore breakout sessions, technical tracks, trainings and more. More than 60% of sessions were led by customers, sharing real-world insights. 90% overall satisfaction rate. Realize LIVE …
Welcome to SMACD 2026 International Conference on Synthesis, Modeling, Analysis and Simulation Methods, and Applications to Circuit Design REGISTER HERE
Join us at CadenceCONNECT: Tech Days Europe 2026, our annual, free, multi-track event dedicated to the engineers, innovators, and visionaries shaping the future of electronic design. Our aim is to bring together like minded thinkers to explore how AI-driven Cadence technologies are transforming design workflows, boosting productivity, and enabling breakthroughs across every domain. REGISTER HERE
About this event Join our upcoming webinar to discover how VisionSym transforms CAD models into photorealistic images using LightTools or LucidShape—eliminating the need for physical prototypes. With GPU-accelerated ray tracing and photometrically accurate simulations, VisionSym enables both design verification and visual appearance evaluation in one streamlined workflow. In this session, you’ll learn how to: Validate designs against …
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About this event This discovery training introduces ImSym – Imaging System Simulator, an advanced platform for end-to-end imaging system simulation. ImSym allows engineers to virtually prototype imaging systems by modeling the full image formation pipeline, from scene and optics through the detector and image signal processing. This enables earlier insight into real-world image performance and …
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Join us at CadenceCONNECT: Tech Days Europe 2026, our annual, free, multi-track event dedicated to the engineers, innovators, and visionaries shaping the future of electronic design. Our aim is to bring together like minded thinkers to explore how AI-driven Cadence technologies are transforming design workflows, boosting productivity, and enabling breakthroughs across every domain. REGISTER HERE
Join us to get the latest on: TSMC's industry-leading HPC, Smartphones, IoT, and Automotive platform solutions TSMC’s advanced logic technology progress on 3nm, 2nm, A16, A14 processes and beyond TSMC 3DFabric® advanced silicon stacking and packaging technology advancement on TSMC-SoIC®, InFO, CoWoS®, and TSMC-SoW™ TSMC’s specialty technology breakthroughs on ultra-low power, RF, embedded memory, power management, …
**Please register with professional email address** As SoC design complexity grows and design windows shrink, EDA tools must evolve beyond traditional workflows. AI is the catalyst! This webinar explores what the next generation of EDA tools and design platforms should look like when built with AI in the middle. We'll define the key criteria that …
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Google Cloud offers powerful compute, networking and GPU/TPUs to run your workloads. But how to feed the beast? EDA workloads require a lot of data and scalable storage plays is that data hub which keeps your workloads going. Google worked with NetApp - a premier on-premises choice for EDA shared storage - to build a …
**Please register with professional email address** As SoC design complexity grows and design windows shrink, EDA tools must evolve beyond traditional workflows. AI is the catalyst! This webinar explores what the next generation of EDA tools and design platforms should look like when built with AI in the middle. We'll define the key criteria that …
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Featured Speakers: Richard Solomon, Senior Staff Technical Product Manager, Synopsys Ron Lowman, Staff Product Manager, Synopsys Heterogeneous compute platforms are driving new requirements for connectivity across increasingly complex system architectures. This webinar explores how PCIe and CXL can be used to provide efficient and high-performance chip-to-chip connectivity, across host-to-memory, host-to-networking, host-to-host, and host-to-accelerator designs in …
Advanced Packaging Summit 2026, under the theme “Packaging the Future of AI – From Silicon to Photon,” will examine the evolution of packaging technologies in the AI era and their broader implications for the semiconductor industry. Featuring presentations by leading industry experts, the summit will explore market shifts driven by the growing demand for AI …
International Test Conference is the world's premier venue dedicated to the electronic test of devices, boards and systems-covering the complete cycle from design verification, design-for-test, design-for-manufacturing, silicon debug, manufacturing test, system test, diagnosis, reliability and failure analysis, and back to process and design improvement. At IEEE ITC India, design, test, and yield professionals can confront …
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About this event Join us for our annual LucidShape User Group Meeting— This year’s meeting brings together the LucidShape community for a day of insights, innovation, and collaboration. Whether you're focused on automotive lighting, simulation workflows, or advanced design techniques, you’ll gain practical knowledge you can apply right away. What You’ll Experience Latest LucidShape Innovations …
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The Long Beach Convention Center will serve as a dynamic venue for DAC 2026: The Chips to Systems Conference. Set along the scenic Southern California coastline, the center offers modern meeting spaces and a vibrant setting that reflects the innovative spirit of DAC. Its central location in downtown Long Beach provides easy access to hotels, …
Where your digital transformation gets real — fast We are excited to be visiting a new city with the Realize LIVE digital transformation conference to showcase artifial intelligence, digitalization, sustainability and optimization across the product lifecycle. Learn, network and connect with the Siemens software community, and walk away with new tools and insights for your …
What is FMS? Our over-arching mission is to help accelerate the move towards a world where advanced memory and storage technologies enable AI systems, data centers, hyperscalers and enterprises to operate at unprecedented scale, speed and efficiency. All the while supporting the engineers and architects building the infrastructure of the future. FUTURE OF MEMORY & …
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Join us on August 12 for CadenceLIVE India 2026, where Cadence technology users connect with the engineers and industry leaders who develop the solutions and the industry experts who influence market trends. Participants experience a day of learning, connection, and cutting-edge technology shaping the future of electronic design and intelligent systems. This premier event brings …
The 35th USENIX Security Symposium will take place on August 12–14, 2026, at the Baltimore Marriott Waterfront in Baltimore, MD, USA. The USENIX Security Symposium brings together researchers, practitioners, system programmers, and others interested in the latest advances in the security and privacy of computer systems and networks. The full symposium program will be available soon; view …
