2026 CMC Conference April 14-16, 2026 “Critical Materials at the Crossroads— Driving the Roadmap for Semiconductor Materials” DoubleTree by Hilton Hotel in Portland, Oregon Featuring Keynote: Ben Sell, Vice President and GM of Logic Technology Development at Intel Corporation *The CMC Conference follows the Private CMC Meetings: CMC Fabs-Only on Apr. 13-14 and CMC Joint Session …
Join us on April 16 for CadenceLIVE Silicon Valley 2026, where Cadence technology users connect with the engineers and industry leaders who develop the solutions and the industry experts who influence market trends. Participants experience a day of learning, connection, and cutting-edge technology shaping the future of electronic design and intelligent systems. This premier event …
Join us for CICC 2026, the world's premier conference devoted to IC development. April 19 – 22, 2026 Seattle, WA, USA April 22 - 23, 2026 - CHISIC Workshop About CICC The IEEE Custom Integrated Circuits Conference is a premier conference devoted to IC development. The conference program is a blend of oral presentations, exhibits, …
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Design, Automation and Test in Europe Conference | The European Event for Electronic System Design & Test Call for Papers The DATE conference is the main European event bringing together designers and design automation users, researchers and vendors, as well as specialists in hardware and software design, test, and manufacturing of electronic circuits and systems. …
Product reliability and qualification continues to evolve with the electronics industry. New electronics applications require new approaches to reliability and qualification. In the past, reliability meant discovering, characterizing and modeling failure mechanisms, and determining their impact on the reliability of the circuit. Today, reliability can involve tradeoffs between performance and reliability; assessing the impact of …
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As AI workloads scale into the thousands of accelerators and hundreds of terabytes of distributed memory, traditional interconnects cannot deliver the deterministic latency, bandwidth efficiency, or memory semantic operations required for modern training clusters. UALink provides a purpose built accelerator fabric leveraging 224G SerDes, fixed 64 byte flits, compressed transaction formats, and high efficiency TL/DLL …
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Ensure fabrication success with proven HDI design techniques and real-world tools. Overview: As AI accelerators and edge compute modules push PCB densities to their physical limits, HDI design has become the defining skill separating production-ready boards from layouts that fail at fabrication. This webinar walks through the complete HDI workflow inside Allegro X using a …
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Join us to get the latest on: TSMC's industry-leading HPC, Smartphones, IoT, and Automotive platform solutions TSMC’s advanced logic technology progress on 3nm, 2nm, A16, A14 processes and beyond TSMC 3DFabric® advanced silicon stacking and packaging technology advancement on TSMC-SoIC®, InFO, CoWoS®, and TSMC-SoW™ TSMC’s specialty technology breakthroughs on ultra-low power, RF, embedded memory, power management, …
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The 2026 MRS Spring Meeting & Exhibit, taking place April 26–May 1 in Honolulu, Hawai‘i, will convene materials researchers from academia, industry, government and national laboratories together for a week of cross-disciplinary collaboration and scientific exchange. Set against the backdrop of one of MRS’s most inspiring locations, the Meeting & Exhibit will feature breakthroughs in areas …
Join us for the User2User North America event, which is a dedicated environment for exchanging ideas, information and best practices that enable you to lead in your role and achieve success with your customers. Become a Speaker About User2User User2User is your opportunity to learn, grow and connect with fellow technical experts who design leading-edge …
In this webinar, Marvell will present how its team accelerates passive interposer routing for advanced 2.5D/3.5D multi die designs by bringing early, physics based signal integrity feedback into each routing iteration. Rather than relying on repeated, compute intensive 3D FEM cycles during development, Marvell uses a Method of Moments (MoM) early SI check available within …
FOCUSED ON SMART MANUFACTURING & SMART MOBILITY DRIVING SEMICONDUCTOR BUSINESS IN THE MIDWEST Thank you for being part of the launch of SEMIEXPO Heartland—where Smart Manufacturing and Smart Mobility came together like never before! This groundbreaking event opened new opportunities for collaboration and growth, driving us toward the semiconductor industry’s $1T future. With so much innovation …
Physical AI is increasingly popular in applications requiring real-time decision making and autonomous operation. Different from NPUs for cloud platforms, Physical AI processors can be made application-specific. By jointly tuning their ISA and memory architecture to the network models required by the application, power consumption and silicon area are drastically reduced. Synopsys ASIP Designer is …
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As semiconductors continue to scale, designers are turning to 3DIC architectures to meet increasing demands for performance, energy efficiency, and functional density in data centers and edge AI applications. However, stacking multiple dies introduces new multiphysics challenges including electrical, structural, and thermal issues. Join this webinar to learn how RedHawk-SC Electrothermal enables designers to analyze …
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Where Innovation Meets Display. Gain insights directly from the experts shaping the future of display technology. Explore next-generation innovations from over 200 leading manufacturers and emerging players. Engage with global engineers, developers, and decision-makers in discussions that are driving technical advancement and commercial impact. Gain fresh perspectives, ingenious strategies, and the motivation to advance your work. The …
The premier symposium that facilitates the rapid growth of hardware-based security research and development. Since 2008, HOST has served as the globally recognized event for researchers and practitioners to advance knowledge and technologies related to hardware security and assurance. May 4 – 7 2026 Washington DC, USA About the Conference Rapid proliferation of computing and …
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Expanding The Coverage of the Electronics Manufacturing Supply Chain! SEMI Southeast Asia SEMI Southeast Asia was established in 1993, the same year the SEMICON Singapore exhibition was established. The aim of the SEMI Southeast Asia office is to provide all of the SEMI International Services to the region in a timely manner. If you happen …
Join us to get the latest on: TSMC's industry-leading HPC, Smartphones, IoT, and Automotive platform solutions TSMC’s advanced logic technology progress on 3nm, 2nm, A16, A14 processes and beyond TSMC 3DFabric® advanced silicon stacking and packaging technology advancement on TSMC-SoIC®, InFO, CoWoS®, and TSMC-SoW™ TSMC’s specialty technology breakthroughs on ultra-low power, RF, embedded memory, power management, …
Join us at CadenceCONNECT: Tech Days Europe 2026, our annual, free, multi-track event dedicated to the engineers, innovators, and visionaries shaping the future of electronic design. Our aim is to bring together like minded thinkers to explore how AI-driven Cadence technologies are transforming design workflows, boosting productivity, and enabling breakthroughs across every domain. REGISTER HERE
Abstract Dive into the future of Bluetooth audio with Ceva and Dolphin Semiconductor’s breakthrough 12nm Smart Edge AIoT SoC solution. This webinar shows how advanced wireless connectivity, integrated AI processing, and premium audio technologies and power management come together to deliver superior performance, lower power, and faster time to market. Learn how a combined Ceva …
Data rates have doubled, but validation methods have not kept pace. As PCIe, DDR, and multi-terabit optical interconnects evolve, engineers are encountering signal integrity challenges much earlier in the design process. Join Niels Fache, Senior Vice President and General Manager of Design Engineering Software at Keysight, to explore where validation becomes more challenging as speeds …
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