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This webinar explores the role of electromagnetic simulation in IoT using Ansys solutions, highlighting cost reduction, reliability, and accelerated design through virtual testing before prototyping. The webinar will be presented by one of our customers, SECO spa. DATE / TIME: April 8, 2025 4 PM CEST Venue: Virtual Overview The best way to solve complex …
As hyperscaler chiplet and SoCs grow in complexity, integrating and validating multiple high-speed and low-speed interface protocols—such as PCIe, CXL, UCIe, AMBA, AXI, AHB, CHI, CSI2, and DSI2, can be a significant challenge. Design Verification Engineers and Technical Managers must ensure seamless protocol compliance while staying focused on their core ASIC design value. Join us …
As hyperscaler chiplet and SoCs grow in complexity, integrating and validating multiple high-speed and low-speed interface protocols—such as PCIe, CXL, UCIe, AMBA, AXI, AHB, CHI, CSI2, and DSI2, can be a significant challenge. Design Verification Engineers and Technical Managers must ensure seamless protocol compliance while staying focused on their core ASIC design value. Join us …
Today’s AI designs stress verification teams to an unprecedented extent. The compound complexity from software, hardware, interfaces, and architecture options leads to the challenge of running quadrillions of verification cycles across IP, sub-systems, SoCs, and Multi-die designs. Learn how leaders from AMD, Arm, Nvidia, and others address these challenges with Synopsys’ latest family of Hardware-Assisted …
Join us on April 9 to discover how to unlock the power of built-in data management using Keysight Design Data Management (SOS) within Cadence Virtuoso Studio. Here’s What You Can Learn How to eliminate design rework and data loss issue How this fully embedded solution enhances productivity and ensures faster Time-to-Market Live demo showcasing seamless …
Discover how cutting-edge transient structural analysis and experimental testing can solve even the toughest challenges in this upcoming presentation. DATE / TIME: April 9, 2025 10 AM EDT / 4 PM CEST / 7:30 PM IST Venue: Virtual Overview This webinar will showcase how transient structural analysis and experimental testing optimized a mass damper to …
Each 45-minute session offers a new opportunity to: Learn and share best practices. Interact with and learn from other users. Have Q&A time with our product experts on usage and methodology. Explore new use models and applications to get the most out of the platform. Moderated by Simon Butler, founder of IPLM, joined by a …
Shanghai Renaissance Pudong Hotel
Renaissance Shanghai Pudong, 719 Yingchun Rd,, Pudong, Shanghai, China
Hello everyone! Welcome to the 2025 DvCon China Conference! As the chair of this conference, l am truly honored to be here with all of you. lt's exciting to gather together and discuss the latest trends and cutting-edge technologies in the field of design verification. In recent years, we've seen tremendous growth in China's chip …
About this event Accurate, precise, and fast RF / μW analysis made simple. Be among the first to explore our newest and most extensive collection of compact signal generators and source analyzers. Experience live product demos and gain insights into the unique features of each product, including: • Ultra-low phase noise • Signal purity • …
The pace of value creation driven by AI is unprecedented, starting with model training in the data center which further enables a vast array of inference applications across different industries. Protecting this valuable data is mission critical. With the introduction of its latest generation CryptoManager Security IP, Rambus offers chip architects and designers the means …
Santa Clara Convention Center
Santa Clara Convention Center, 5001 Great America Pkwy, Santa Clara, CA, United States
Join us to get the latest on: TSMC's industry-leading HPC, Smartphone, IoT, and Automotive platform solutions to advance the AI future TSMC’s advanced logic technology progress on 5nm, 4nm, 3nm, 2nm, A16 processes and beyond TSMC 3DFabric® advanced silicon stacking and packaging technology advancement on TSMC-SoIC®, InFO, CoWoS®, and TSMC-SoW™ TSMC’s specialty technology breakthroughs on ultra-low …
San Jose McEnery Convention Center
150 W San Carlos St, San Jose, CA, United States
Transform your Perspective Gain insights into how our customers and partners collaborate with Intel Foundry, explore cutting-edge packaging and test solutions, and delve into the world of resilient supply chains. Get ready to be inspired for the future! Engage with Experts Discover how our cutting-edge process technologies and strong ecosystem alliances have converged into a …
Hyatt Regency Austin
Hyatt Regency Austin, 208 Barton Springs Rd, Austin, TX, United States
Join us to get the latest on: TSMC's industry-leading HPC, Smartphone, IoT, and Automotive platform solutions to advance the AI future TSMC’s advanced logic technology progress on 5nm, 4nm, 3nm, 2nm, A16 processes and beyond TSMC 3DFabric® advanced silicon stacking and packaging technology advancement on TSMC-SoIC®, InFO, CoWoS®, and TSMC-SoW™ TSMC’s specialty technology breakthroughs on ultra-low …
Join us for an Q&A technical session with Madhumita Sanyal, technical product director of HPC IP, and Richard Solomon, principal product manager and vice-president of PCI-SIG, discussing the pivotal role of PCIe 7.0 in enabling high-performance computing, AI clusters, and next-gen chip designs. This session will explore the need of transitioning to PCIe 7.0 for …
Webinar content Smart vibration sensors are used, among other things, in infrastructure monitoring in smart cities and in condition monitoring on machines and industrial plants. The sensors used are often based on microelectronic sensors (MEMS), which are tested as components in production but sometimes exhibit different vibration properties in the finished sensor system. In this …
