Webinar: Connecting Chiplets Isn’t Enough – Solving the Data Movement Challenge in Multi-Die Systems
Thursday, November 5, 2026
11:00am PST | 2:00pm EST | 20:00 CET
As SoCs evolve into multi-die systems, getting data across a die-to-die interface is only part of the challenge. Architects must also preserve traffic behavior, bandwidth efficiency and quality of service as communication moves across physical chip boundaries.
Join this 30-minute BitCast as our expert explores how extending NoC connectivity across die boundaries enables engineering teams to scale from monolithic SoCs to multi-die architectures without reinventing the way data moves through the system.
Attendees will gain insight into:
- Why AI is driving the move to multi-die
- What changes when the SoC crosses a die boundary
- Why die-to-die connectivity alone isn’t enough
- Extending the NoC across chip boundaries
- Coherent vs. non-coherent multi-die architectures
- What architects should consider before partitioning a design
Not sure if you will be able to attend? No problem! All registrants will receive a link to watch the presentation on-demand after the live event.
Speaker:
Rick Bye
Director of Product Management & Marketing, Arteris
Rick is responsible for non-coherent NoC IP products. Previously Rick was at Arm, responsible for system IP and 3D packaged multi-die SoCs. Rick has extensive SoCs and embedded software experience, with prior design engineering and marketing roles at Texas Instruments, Broadcom, Silicon Labs, NXP and Foundries.io (Qualcomm). He has a BSc in Electronics from the University of Manchester and an Executive MBA from the University of Texas at Austin.
LinkedIn: https://www.linkedin.com/in/rick-bye/
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