IEEE International Conference on PHYSICAL ASSURANCE and INSPECTION of ELECTRONICS (PAINE)
October 14 - October 16
ABOUT PAINE
Physical inspection of electronics has grown significantly over the past decade and is becoming a major focus for the chip designers, original equipment manufacturers, and system developers. The complex long life of the electronic devices coupled with their diverse applications is making them increasingly vulnerable to various forms of threats and inspection. Large industry and government efforts have been put in place across the globe to address related supply chain security problems to offer solutions, training, and services. The number of programs introduced by the US government has increased over the years to analyze and develop relevant solutions. Although much focus is given to the digital domain, physical assurance and inspection of electronics as well as physical fingerprinting based on analog parameters are rapidly providing opportunities for unique countermeasures.
PAINE conference provides a unique venue for all researchers and practitioners from academia, industry, and government to have productive dialog on such topics. Accepted papers will be submitted for inclusion into IEEE Xplore subject to meeting IEEE Xplore’s scope and quality requirements. PAINE covers the broad topic of hardware security and trust; example topics of interest include but are not limited to:
Topics to be Covered:
- New metrologies for characterization and assurance
- Advanced packaging and heterogenous integration
- Emerging topics in physical inspection and assurance
- Image analysis and artificial intelligence for assurance and inspection
- Metrologies characterization
- Automated inspection and metrology for advanced packaging
- Security primitives: Novel devices, materials, and systems
- Test vehicles and performance quantification
- Additive manufacturing assurance for electronics
- Physical and design interface assurance
- Trojans and backdoors: Detection and prevention
- Workforce Development
- Fault injection assessment and countermeasures
- Side channel assessment (power, timing, EM) for assurance and countermeasures
- Analog & mixed-signal circuits and systems security
- FPGA Bitstream protection and vulnerabilities
- Counterfeit Detection and Anti-Counterfeit Technique
- Novel material and devices for assurance
- Sample Preparation
- PCB trust and assurance
- Chip and PCB level decomposition for assurance
- FIB/SEM for assurance
- Electro-optical probing using PEM, EOP, EOFM, etc.
- Physical/side channel fingerprinting
- Mod-chip on PCB
- Microprobing and nanoprobing
- Bus-snooping
- Field-based weakness
- Countermeasures against tampering and decomposition
- Functionality validation
- Process improvements
- Failure analysis and fault isolation
- Physical/logical shielding etc.
- Photonics Assurance
Relaxation-Aware Programming in ReRAM: Evaluating and Optimizing Write Termination