Banner Electrical Verification The invisible bottleneck in IC design updated 1
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Agile Analog Update at #62DAC

Agile Analog Update at #62DAC
by Daniel Payne on 07-21-2025 at 10:00 am

agile analog min

On the last day of DAC 2025 I met with Chris Morrison, VP of Product Marketing at Agile Analog, to get an update. Their company provides Analog IP, the way you want it, and I knew that they had internal tools and a novel methodology to speed up the development process. This year they have started talking more about their internal IP automation… Read More


Sophisticated soundscapes usher in cache-coherent multicore DSP

Sophisticated soundscapes usher in cache-coherent multicore DSP
by Don Dingee on 07-16-2025 at 10:00 am

A Tensilica 2 to 8 core SMP DSP adds cache-coherence for high-end audio processing and other applications

Digital audio processing is evolving into an art form, particularly in high-end applications such as automotive, cinema, and home theater. Innovation is moving beyond spatial audio technologies to concepts such as environmental correction and spatial confinement. These sophisticated soundscapes are driving a sudden increase… Read More


Alphawave Semi and the AI Era: A Technology Leadership Overview

Alphawave Semi and the AI Era: A Technology Leadership Overview
by Daniel Nenni on 07-14-2025 at 8:00 am

AI Market Silicon Forecast 2025

The explosion of artificial intelligence (AI) is transforming the data center landscape, pushing the boundaries of compute, connectivity, and memory technologies. The exponential growth in AI workloads—training large language models (LLMs), deploying real-time inference, and scaling distributed applications—has … Read More


Podcast EP297: An Overview of sureCore’s New Silicon Services with Paul Wells

Podcast EP297: An Overview of sureCore’s New Silicon Services with Paul Wells
by Daniel Nenni on 07-11-2025 at 10:00 am

Dan is joined by sureCore CEO Paul Wells. Paul has worked in the semiconductor industry for over 25 years including two years as director of engineering for Pace Networks, where he led a multidisciplinary, 70 strong product development team creating a broadcast quality video & data mini-headend. Before that, he worked for… Read More


AI Booming is Fueling Interface IP 23.5% YoY Growth

AI Booming is Fueling Interface IP 23.5% YoY Growth
by Eric Esteve on 07-10-2025 at 6:00 am

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AI explosion is clearly driving semi-industry since 2020. AI processing, based on GPU, need to be as powerful as possible, but a system will reach optimum only if it can rely on top interconnects. The various sub-system need to be interconnected with ever more bandwidth and lower latency, creating the need for ever advanced protocol… Read More


Arteris Simplifies Design Reuse with Magillem Packaging

Arteris Simplifies Design Reuse with Magillem Packaging
by Mike Gianfagna on 07-08-2025 at 6:00 am

Arteris Simplifies Design Reuse with Magillem Packaging

Many know Arteris as the “network-on-chip”, or NoC, company. Through acquisitions and forward-looking development, the footprint for Arteris has grown beyond smart interconnect IP. At DAC this year, Arteris highlighted its latest expansion with a new SoC integration automation product called Magillem Packaging. The announcement… Read More


MEMS Technology – From Fringe to Mainstream

MEMS Technology – From Fringe to Mainstream
by Daniel Nenni on 07-07-2025 at 10:00 am

MEMs 2025 SemiWiki

Last month, Lj Ristic delivered an invited talk on MEMS technology as a driving force at the Laser Display and Lighting Conference 2025, held at Trinity College Dublin.  His talk included a review of some major successes of MEMS industry. We used that occasion to talk to him and discuss some major achievements and the status of MEMS… Read More


WEBINAR: Edge AI Optimization: How to Design Future-Proof Architectures for Next-Gen Intelligent Devices

WEBINAR: Edge AI Optimization: How to Design Future-Proof Architectures for Next-Gen Intelligent Devices
by Daniel Nenni on 07-03-2025 at 10:00 am

Ceva webinar AI Arch SEMI 400X400 250625

Edge AI is rapidly transforming how intelligent solutions are designed, from smart home devices to autonomous vehicles, healthcare gadgets, and industrial IoT. Yet, architects, chip designers, and product managers frequently grapple with a common and daunting challenge: creating efficient, high-performance AI solutions… Read More


WEBINAR Unpacking System Performance: Supercharge Your Systems with Lossless Compression IPs

WEBINAR Unpacking System Performance: Supercharge Your Systems with Lossless Compression IPs
by Daniel Nenni on 07-03-2025 at 6:00 am

CAST Compression IP Webinar 400x400

In today’s data-driven systems—from cloud storage and AI accelerators to automotive logging and edge computing—every byte counts. The exponential growth in data volumes, real-time processing demands, and constrained bandwidth has made efficient, lossless data compression a mission-critical requirement. Software-based… Read More


Siemens EDA Unveils Groundbreaking Tools to Simplify 3D IC Design and Analysis

Siemens EDA Unveils Groundbreaking Tools to Simplify 3D IC Design and Analysis
by Kalar Rajendiran on 07-01-2025 at 10:00 am

Innovator3D IC Solution Suite

In a major announcement at the 2025 Design Automation Conference (DAC), Siemens EDA introduced a significant expansion to its electronic design automation (EDA) portfolio, aimed at transforming how engineers design, validate, and manage the complexity of next-generation three-dimensional integrated circuits (3D ICs).… Read More