Hot Chips 2026, formally the thirty-eighth Symposium on High Performance Chips, arrives at Stanford’s Memorial Auditorium from August 23 through 25 with a program that captures a decisive shift in computer architecture. Peak arithmetic throughput remains important, but the conference is increasingly about system balance:… Read More
Meet Quadric on the Road: Three Must-Attend AI Events
This late summer, Quadric is taking its vision for programmable, on-device AI to three of the industry’s most influential gatherings. From advanced processor design at HotChips to scalable deployment at the AI Infra Summit and physical AI at Embedded World North America, each stop offers a different opportunity to see how the… Read More
Beyond Moore: Co-Optimizing AI from Systems to Materials
At the OCP APAC Summit in Taiwan, August 11–12, 2026, Applied Materials’ Subi Kengeri framed artificial intelligence as the semiconductor industry’s largest inflection point. AI demand is accelerating the industry toward one trillion dollars in annual revenue, but the keynote’s central message was more consequential than… Read More
Focusing on the AI Big Picture with Moores Lab AI at DAC 2026
DAC 2026 proved that agentic AI design flows are here to stay. The news was conveyed both by familiar companies who we’ve seen at DAC many times before as well as new entrants to the show and the industry. Many of the solutions that were presented focused on a specific part of the design flow. Others took a broader view of the problem and… Read More
Podcast EP361: An Overview of the AI Infra Summit with Ed Nelson
Daniel is joined by Ed Nelson, Strategy Director and Co-Founder of AI Infra Summit. He co-leads the production team and specializes in product strategy and management, keynote speaker acquisition and VIP network development. Ed started the summit in 2018 and has spent nearly ten years as part of the team building AI Infra Summit… Read More
ChipAgents Leads the AI Revolution at DAC 2026
I believe this year’s DAC will be viewed as the time and place where EDA experienced a major shift. That is, the shift from the value of tools and methodology to the value of agentic design flows powered by highly trained agents. The design community will clearly need the tools and methodologies that have occupied DAC for years. But… Read More
Tuple Technologies at DAC 2026
At #DAC2026 I met with Vamshi Kothur at Tuple Technologies to see how their cloud infrastructure products help IC design teams get their chip designs to market more quickly without the overhead of big IT and CAD teams. Tuple was founded in 2017 and has grown to about 45 people, headquartered in New Jersey. The challenge of using complex… Read More
Boost Front-End SoC Design With Defacto’s AI-Powered Tool
Front-end SoC design has always been a balancing act between speed, accuracy, and the large amount of manual work required to get RTL, IPs, and collaterals to be aligned. In a recent webinar, Defacto CEO and founder Chouki Aktouf joined by product manager Valentin Boyer, walked through how the company is bringing AI directly into… Read More
Agentrys Launches Agentic Design Automation at DAC 2026
There were many new agentic design flows introduced at DAC this year. Some from mainstream providers and others from new startups. The increased level of activity around this technology was good to see. Most of the approaches presented at the conference were targeting specific parts of the flow. Verification and debug were popular… Read More
DAC 2026: How Undo Makes AI for Chip Design Work Better
DAC was abuzz this year with new AI-fueled approaches to chip design and debug. New tools powered by deeply trained models opened substantial possibilities to deliver higher quality designs much faster, potentially with less resources. Every new technology has its risks. For AI-driven chip design some of those risks center … Read More


Verification IP proves essential for PCIe GEN5