Bronco Webinar SemiWiki
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Bronco AI at DAC 2026, What a Difference a Year Makes

Bronco AI at DAC 2026, What a Difference a Year Makes
by Mike Gianfagna on 08-26-2026 at 6:00 am

Bronco AI at DAC 2026, What a Difference a Year Makes

During my time at DAC 2026 I felt like I was attending two events. One was the traditional DAC where approaches to designing complex chips using the best tools and methodologies were the focus. There was another focus for the conference. This one was like the traditional DAC with an important difference. Here, the discussion centered… Read More


Intel Wildcat Lake: Right-Sizing Silicon Without Sinking Performance

Intel Wildcat Lake: Right-Sizing Silicon Without Sinking Performance
by Admin on 08-25-2026 at 2:00 pm

Intel Wildcat Hot Chips 2026

Lance Hacking, Intel

Intel Core Series 3, code-named Wildcat Lake, is a mainstream client system-on-chip derived from the Panther Lake-based Core Ultra Series 3 architecture. Its design objective is not maximum feature density, but broad deployment of current-generation CPU, graphics, AI, memory, security, and connectivity… Read More


Webinar: Warpage has a Timing Problem

Webinar: Warpage has a Timing Problem
by Daniel Nenni on 08-25-2026 at 9:00 am

Thermo mechanical (1)

In advanced packaging, warpage is rarely a modeling problem. It is a timing problem.

JOHN BRUGGEMAN


By the time many advanced packages undergo high-fidelity thermo-mechanical analysis, a long chain of decisions has already been made. Stackup. Materials. Die placement. Package architecture. Each decision constrains the Read More


What Hot Chips 2026 Tells Us About What Silicon Valley Is Actually Building

What Hot Chips 2026 Tells Us About What Silicon Valley Is Actually Building
by Jonah McLeod on 08-23-2026 at 6:00 pm

What Hot Chips Tells us 2026

Here’s what the presentations selected for the 2026 Hot Chips Conference tell us about what Silicon Valley companies are doing these days.

The conference, running this week at Stanford’s Memorial Auditorium, doesn’t publish detailed abstracts ahead of time, but the program itself, just the lineup of who’s presenting what, … Read More


Reducing EUV Exposure Dose Through Underlayer Engineering

Reducing EUV Exposure Dose Through Underlayer Engineering
by Admin on 08-23-2026 at 2:00 pm

Reducing EUV Exposure Dose Through Underlayer Engineering

Extreme-ultraviolet lithography is essential for manufacturing advanced semiconductor devices, but its continued scaling presents a difficult materials problem. Photoresists must simultaneously provide high resolution, low exposure dose, limited line-edge or linewidth roughness, and extremely low defectivity. … Read More


Agentrys Shows You How to Build a Multi-Agent System in 30 Minutes

Agentrys Shows You How to Build a Multi-Agent System in 30 Minutes
by Mike Gianfagna on 08-20-2026 at 2:00 pm

Agentrys Shows You How to Build a Multi Agent System in 30 Minutes

Agentrys believes that a purpose-built multi-agent system for chip design shouldn’t be a quarter-long project. Agentic AI systems are becoming quite popular to cut design time and increase quality for complex chip design projects. The challenge is finding the right agentic flow for a particular application. There are… Read More


Hot Chips 2026: Architectures for the Agentic Computing Era

Hot Chips 2026: Architectures for the Agentic Computing Era
by Daniel Nenni on 08-19-2026 at 2:00 pm

Hot Chips 2026 Agentrys Quadric SemiWiki

Hot Chips 2026, formally the thirty-eighth Symposium on High Performance Chips, arrives at Stanford’s Memorial Auditorium from August 23 through 25 with a program that captures a decisive shift in computer architecture. Peak arithmetic throughput remains important, but the conference is increasingly about system balance:… Read More


Meet Quadric on the Road: Three Must-Attend AI Events

Meet Quadric on the Road: Three Must-Attend AI Events
by Daniel Nenni on 08-19-2026 at 6:00 am

Catch Quadric Hot Chips AI Infra

This late summer, Quadric is taking its vision for programmable, on-device AI to three of the industry’s most influential gatherings. From advanced processor design at HotChips to scalable deployment at the AI Infra Summit and physical AI at Embedded World North America, each stop offers a different opportunity to see how the… Read More


Beyond Moore: Co-Optimizing AI from Systems to Materials

Beyond Moore: Co-Optimizing AI from Systems to Materials
by Daniel Nenni on 08-18-2026 at 10:00 am

Beyond Moore AI from manufacturing to Systems

At the OCP APAC Summit in Taiwan, August 11–12, 2026, Applied Materials’ Subi Kengeri framed artificial intelligence as the semiconductor industry’s largest inflection point. AI demand is accelerating the industry toward one trillion dollars in annual revenue, but the keynote’s central message was more consequential than… Read More


Focusing on the AI Big Picture with Moores Lab AI at DAC 2026

Focusing on the AI Big Picture with Moores Lab AI at DAC 2026
by Mike Gianfagna on 08-18-2026 at 6:00 am

Focusing on the AI Big Picture with Moores Lab AI at DAC 2026

DAC 2026 proved that agentic AI design flows are here to stay. The news was conveyed both by familiar companies who we’ve seen at DAC many times before as well as new entrants to the show and the industry. Many of the solutions that were presented focused on a specific part of the design flow. Others took a broader view of the problem and… Read More