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RISC-V Now! — Where Specification Meets Scale!

RISC-V Now! — Where Specification Meets Scale!
by Daniel Nenni on 03-31-2026 at 8:00 am

RVN! 26 SemiWiki (400 x 400 px) (1)

In forty plus years as a semiconductor professional I have never seen a semiconductor design ecosystem build as fast and as strong as RISC-V. As a result, RISC-V Now! has emerged as a pivotal gathering, a conference with a clear and ambitious mission: To transform the open, modular, and flexible RISC-V ISA from an exciting specificationRead More


Sensors Converge: Where Intelligence Meets the Edge

Sensors Converge: Where Intelligence Meets the Edge
by Daniel Nenni on 03-29-2026 at 6:00 pm

Sensors Merge 2026 SemiWiki

The Sensors Converge Conference is one of the premier technical gatherings dedicated to the design, integration, and deployment of sensing technologies across industries. The event brings together engineers, system architects, researchers, and product developers to explore advancements in sensor hardware, edge computing,… Read More


Chemical Origins of Environmental Modifications to MOR Lithographic Chemistry

Chemical Origins of Environmental Modifications to MOR Lithographic Chemistry
by Daniel Nenni on 03-25-2026 at 10:00 am

Chemical Origins of Environmental Modifications to MOR Lithographic Chemistry

In the pursuit of advanced extreme ultraviolet (EUV) lithography for high-NA patterning, metal oxide resists (MORs) offer significant promise but face challenges like critical dimension (CD) variation due to atmospheric interactions. Presented at SPIE Advanced Lithography + Patterning 2025 by Kevin M. Dorney and colleagues… Read More


Arteris Highlights a Path to Scalable Multi-Die Systems at the Chiplet Summit

Arteris Highlights a Path to Scalable Multi-Die Systems at the Chiplet Summit
by Mike Gianfagna on 03-23-2026 at 6:00 am

Arteris Highlights a Path to Scalable Multi Die Systems at the Chiplet Summit

At the recent Chiplet Summit, presentations, discussions and general participation could be broken down into a few broad categories. There were presentations of actual chiplet designs, either as building blocks or end products. There were presentations regarding design tools and methodologies to support and accelerate … Read More


WEBINAR: Reclaiming Clock Margin at 3nm and Below

WEBINAR: Reclaiming Clock Margin at 3nm and Below
by Daniel Nenni on 03-19-2026 at 2:00 pm

Webinar Blog Image Reclaiming Clock Margin

At 3nm and below, clock networks have quietly become the dominant limiter of SoC power, performance, and yield. Yet most advanced-node designs still rely on abstraction-based signoff methodologies developed when voltage headroom was generous and interconnect effects were secondary.

That assumption no longer holds

As supply… Read More


Siemens Wins Best in Show Award at Chiplet Summit and Targets Broad 3D IC Design Enablement

Siemens Wins Best in Show Award at Chiplet Summit and Targets Broad 3D IC Design Enablement
by Mike Gianfagna on 03-19-2026 at 8:00 am

Siemens Wins Best in Show Award at Chiplet Summit and Targets Broad 3D IC Enablement

The recent Chiplet Summit in Santa Clara was buzzing with new designs and new design methods. It felt like the industry had turned a corner at this year’s event with lots of new technology and design success on display. Siemens EDA had a large presence at the show and took home the Best in Show Award for Packaging Design. There were a … Read More


Verification Analytics: The New Paradigm with Cogita-PRO at DVCON 2026

Verification Analytics: The New Paradigm with Cogita-PRO at DVCON 2026
by Daniel Nenni on 03-18-2026 at 8:00 am

The Cogita PRO Paradigm

Cogita-PRO, developed by Vtool, introduces a transformative approach to design verification by treating it as a big data challenge rather than a traditional debugging exercise. Released in February 2026, this tool shifts the focus from manual log and waveform inspection to advanced verification analytics powered by data … Read More


TSMC Technology Symposium 2026: Advancing the Future of Semiconductor Innovation

TSMC Technology Symposium 2026: Advancing the Future of Semiconductor Innovation
by Daniel Nenni on 03-16-2026 at 10:00 am

TSMC Technology Symposium 2026

One of my favorite times of the year is coming (sailing season) and my favorite event of the year is coming as the company I most respect will host the best international semiconductor networking event starting here in Silicon Valley.

The 32nd annual TSMC Technology Symposium represents one of the most influential events in the … Read More


Synopsys Explores AI/ML Impact on Mask Synthesis at SPIE 2026

Synopsys Explores AI/ML Impact on Mask Synthesis at SPIE 2026
by Mike Gianfagna on 03-16-2026 at 6:00 am

Synopsys Explores AI:ML Impact on Mask Synthesis at SPIE 2026

The SPIE Advanced Lithography + Patterning Symposium recently concluded. This is a popular event where leading researchers gather. Challenges such as optical and EUV lithography, patterning technologies, metrology, and process integration for semiconductor manufacturing and adjacent applications are all covered. This… Read More


Unraveling Dose Reduction in Metal Oxide Resists via Post-Exposure Bake Environment

Unraveling Dose Reduction in Metal Oxide Resists via Post-Exposure Bake Environment
by Daniel Nenni on 03-15-2026 at 4:00 pm

Unraveling Dose Reduction in Metal Oxide Resists via Post Exposure Bake Environment

In the realm of extreme ultraviolet (EUV) lithography, metal oxide resists (MORs) have emerged as promising candidates for advanced semiconductor patterning. However, their stability poses challenges, particularly interactions with clean-room environments like humidity and airborne molecular contaminants (AMCs) … Read More