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By Richard Curtin
Ever since the Silicon Catalyst 2023 Semiconductor Industry Forum (“Welcome to our AI Wonderland”) I’ve been convinced that the Nobel Prize committee needs to consider awarding a posthumous award to Sir Arthur.
To remind you, Sir Arthur’s “2001: A Space Odyssey” movie was released in 1968. At that point in time… Read More
At Hot Chips 2026, OpenAI presented Jalapeño, an inference ASIC built with AI in the design loop. As reported from the session by ServeTheHome and Tom’s Hardware, OpenAI showed measured block-level wins over a human baseline — 56% on a BF16 multiply, alongside a 10% smaller matrix-unit area — within a roughly nine-month path from… Read More
TSMC is describing an artificial intelligence boom that reaches beyond accelerator chips into the wider computing infrastructure needed to support increasingly capable AI systems. On the recent investor call, Chairman and CEO Dr. C.C. Wei presents strong demand, persistent supply constraints and an ambitious expansion … Read More
The Design Automation Conference is the premier semiconductor ecosystem conference. I have attended 43 DACs including the most recent one in Long Beach. My first DAC was in Albuquerque NM. It was a month after my University so i was still in college mode. DAC was quite the celebration back then so I fit right in
I remember conferences… Read More
TSMC’s 2026 Open Innovation Platform Forum presented artificial intelligence as the force reshaping semiconductor design. Its central argument is that faster chips will require progress across the whole system: logic, memory, packaging, interconnects, power delivery and design methods. TSMC places its partner ecosystem… Read More
It’s an honor to attend events like this as a guest, and even more so as a speaker. On Friday at 3:30 p.m., I’ll be moderating a panel with the CEOs of three of the hottest AI startups. I definitely have a few questions ready for them! My beautiful wife and I will also be at the banquet. I hope to see you there!
The CASPA CEO Summit arrives … Read More
The rapid growth of AI at the edge is forcing SoC architects to rethink traditional processor designs. Dedicated NPUs deliver impressive performance for today’s models, but evolving AI workloads, increasing system complexity and growing pressure on power and silicon budgets are exposing the limitations of fixed-function… Read More
One of the standout presentations at the 2026 TSMC OIP Forum highlighted a collaboration between Siemens EDA, Marvell, and TSMC. I always appreciate EDA presentations that bring together customer and foundry perspectives, and this one did not disappoint. We follow 3D IC technology closely and have published more than 150 blogs… Read More
Artificial intelligence is moving beyond the screen. The attached presentation describes a shift from systems that generate text, images, and code to systems that can perceive their surroundings and take action. These systems could guide robots, vehicles, factory equipment, medical devices, and critical infrastructure.… Read More
The TSMC OIP Ecosystem Forum highlighted many accomplishments across TSMC’s vast ecosystem. Specific achievements with TSMC as well as collaborative work across several companies were all on display.
And there was an exhibit area where you could meet the companies behind many of these stories and learn more about them.
This … Read More
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Rethinking Phase Jitter: An Algorithmic Approach to Signal Integrity