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Navigating SoC Tradeoffs from IP to Ecosystem

Navigating SoC Tradeoffs from IP to Ecosystem
by Daniel Nenni on 12-17-2025 at 8:00 am

Building an SoC is Hard 2025

Building a complex SoC is a risky endeavor that demands careful planning, strategic decisions, and collaboration across hardware and software domains. As highlighted in Darren Jones’ RISC-V Summit presentation from Andes Technology, titled “From Blueprint to Reality: Navigating SoC Tradeoffs, IP, and Ecosystem,”… Read More


A Webinar About Electrical Verification – The Invisible Bottleneck in IC Design

A Webinar About Electrical Verification – The Invisible Bottleneck in IC Design
by Mike Gianfagna on 12-16-2025 at 6:00 am

A Webinar About Electrical Verification – The Invisible Bottleneck in IC Design

Electrical rule checking (ERC) is a standard part of any design flow. There is a hidden problem with the traditional approach, however. As designs grow in complexity, whether full-custom analog, mixed-signal, or advanced-node digital, the limitations of traditional ERC tools are becoming more problematic. This can lead to… Read More


WEBINAR: Why Network-on-Chip (NoC) Has Become the Cornerstone of AI-Optimized SoCs

WEBINAR: Why Network-on-Chip (NoC) Has Become the Cornerstone of AI-Optimized SoCs
by Admin on 12-15-2025 at 8:00 am

AION Silicon Arteris Webinar

By Andy Nightingale, VP of Product Management and Marketing

As AI adoption accelerates across markets, including automotive ADAS, large-scale compute, multimedia, and edge intelligence, the foundations of system-on-chip (SoC) designs are being pushed harder than ever. Modern AI engines generate tightly coordinated, … Read More


AI-Driven DRC Productivity Optimization: Insights from Siemens EDA’s 2025 TSMC OIP Presentation

AI-Driven DRC Productivity Optimization: Insights from Siemens EDA’s 2025 TSMC OIP Presentation
by Daniel Nenni on 12-09-2025 at 10:00 am

AI Driven DRC Productivity Optimization Siemens AMD TSMC

 

In the rapidly evolving semiconductor industry, Design Rule Checking (DRC) remains a critical bottleneck in chip design workflows. Siemens EDA’s presentation at the 2025 TSMC Open Innovation Platform Forum, titled “AI-Driven DRC Productivity Optimization,” showcases how artificial intelligence … Read More


Revitalizing Semiconductor StartUps

Revitalizing Semiconductor StartUps
by Daniel Nenni on 12-09-2025 at 6:00 am

Silicon Catalyst Hero

Tarun Verma, Managing Partner of Silicon Catalyst, delivered a keynote at Verification Futures Austin titled “Revitalizing Semiconductor StartUps.” Drawing from his role in the world’s only accelerator focused on the global semiconductor industry, Tarun outlined the sector’s resurgence, persistent… Read More


Cerebras AI Inference Wins Demo of the Year Award at TSMC North America Technology Symposium

Cerebras AI Inference Wins Demo of the Year Award at TSMC North America Technology Symposium
by Daniel Nenni on 12-07-2025 at 2:00 pm

Cerebras TSMC OIP 2025

This is a clear reminder of how important the semiconductor ecosystem is and how closely TSMC works with customers. The TSMC Symposium started 30 years ago and I have been a part of it ever since.  This event is attended by TSMC’s top customers and partners and is the #1 semiconductor networking event of the year, absolutely.… Read More


WEBINAR: Defacto’s SoC Compiler AI: Democratizing SoC Design with Human Language

WEBINAR: Defacto’s SoC Compiler AI: Democratizing SoC Design with Human Language
by Daniel Nenni on 12-04-2025 at 10:00 am

webinar square2025 (1)

Modern chip design has reached unprecedented levels of complexity. Today’s System-on-Chip (SoC) designs integrate multiple processors, complex memory hierarchies, sophisticated interconnects, and much more. All requiring orchestration using complex EDA tool flows. Months are routinely lost to configuration… Read More


Accelerating SRAM Design Cycles: MediaTek’s Adoption of Siemens EDA’s Additive AI Technology at TSMC OIP 2025

Accelerating SRAM Design Cycles: MediaTek’s Adoption of Siemens EDA’s Additive AI Technology at TSMC OIP 2025
by Daniel Nenni on 12-02-2025 at 10:00 am

Siemens MediaTek TSMC OIP 2025

In the competitive vertical of mobile System-on-Chip development, SRAM plays a pivotal role, occupying nearly 40% of chip area and directly impacting yield and performance. The presentation “Accelerating SRAM Design Cycles With Additive AI Technology,” co-delivered by Mohamed Atoua of Siemens EDA and Deepesh… Read More


Podcast EP320: The Emerging Field of Quantum Technology and the Upcoming Q2B Event with Peter Olcott

Podcast EP320: The Emerging Field of Quantum Technology and the Upcoming Q2B Event with Peter Olcott
by Daniel Nenni on 12-01-2025 at 9:00 am

Daniel is joined by Peter Olcott, Deeptech Principal at First Spark Ventures specializing in early-stage investments. His background encompasses over 20 years of experience in electrical engineering, software engineering, algorithm design, combined hardware-software robotic devices, and novel innovations in biomedical… Read More


WEBINAR: Revolutionizing Electrical Verification in IC Design

WEBINAR: Revolutionizing Electrical Verification in IC Design
by Daniel Nenni on 11-27-2025 at 10:00 am

Electrical Verification – The invisible bottleneck in IC design 2

In the complex world of IC design, electrical verification has emerged as a critical yet often overlooked bottleneck. Aniah’s upcoming webinar on December 4, 2025, titled “Electrical Verification: The Invisible Bottleneck in IC Design,” sheds light on this issue, introducing their groundbreaking OneCheck® solution. … Read More