Step into the future of semiconductor design management with IPLM: Future Forward, a product-led webinar showcasing the latest developments in Perforce IPLM. This focused session is designed to show how modern teams can tackle growing design complexity while still accelerating innovation.
Hosted by IPLM… Read More
The semiconductor industry is entering a post-Moore’s Law era in which scaling transistor density alone is no longer sufficient to sustain historical performance growth. As discussed in the panel Beyond Moore’s Law: The Future of Semiconductor Manufacturing, the industry is increasingly dependent on advanced manufacturing… Read More
Given the success of the event in Silicon Valley last week, I would expect the Siemens U2U event in Munich to be even bigger. In my experience this has been the best user driven event in 2026 with the deepest customer content. EDA has always been a customer driven industry and it is good to see us recognize that from time to time. Kalar … Read More
Daniel is joined by David Drain, show director for Questex’s Sensors Converge and Broadband Nation Expo, where he leads strategy, content, and industry engagement for two of the company’s flagship technology events. Prior to joining Questex, David spent more than 15 years with Networld Media Group, most recently as senior vice… Read More
L.C. leads efforts in design enablement, ensuring that the company can meet the diverse and evolving requirements of its global customer base. Prior to this, he headed the Design and Technology Platform organization starting in 2018.
Since joining TSMC in 2000, Dr. Lu has held multiple leadership positions in design services.… Read More
Dr. Y.J. Mii joined TSMC in 1994 as a manager at Fab 3 before moving into the company’s research and development organization in 2001. He was appointed Vice President of R&D in 2011 and later advanced to Senior Vice President in November 2016.
Over more than 20 years at TSMC, Dr. Mii has played a central role in advancing and manufacturing… Read More
The rapid evolution of wireless audio has placed unprecedented demands on system integration, power efficiency, and performance. Against this backdrop, the webinar “All-in-One Bluetooth Audio: A Complete Solution on a TSMC 12nm Single Die” offers a timely and technically rich exploration of how modern semiconductor design… Read More
Yes, it is that time of year again, the 2026 TSMC Technology Symposium kick-off event in Silicon Valley. TSMC has never been in a better position to forecast the future of semiconductor technology and the industry itself. TSMC closely collaborates with the top semiconductor companies around the world and the top players in the … Read More
The recent Chiplet Summit 2026 was a great place to learn about new chiplet designs, emerging standards, and a growing array of support technologies to help design and manufacture chiplet-based systems. In my travels at the show, I found a lot of technology that fit these descriptions. But there were also companies at the show that… Read More
Siemens U2U 3D IC Design and Verification Panel