TSMC’s 2026 Open Innovation Platform Forum presented artificial intelligence as the force reshaping semiconductor design. Its central argument is that faster chips will require progress across the whole system: logic, memory, packaging, interconnects, power delivery and design methods. TSMC places its partner ecosystem… Read More
CASPA CEO Summit and Why it Matters
It’s an honor to attend events like this as a guest, and even more so as a speaker. On Friday at 3:30 p.m., I’ll be moderating a panel with the CEOs of three of the hottest AI startups. I definitely have a few questions ready for them! My beautiful wife and I will also be at the banquet. I hope to see you there!
The CASPA CEO Summit arrives … Read More
Beyond the Die: Verifying the Connected Chip
One of the standout presentations at the 2026 TSMC OIP Forum highlighted a collaboration between Siemens EDA, Marvell, and TSMC. I always appreciate EDA presentations that bring together customer and foundry perspectives, and this one did not disappoint. We follow 3D IC technology closely and have published more than 150 blogs… Read More
From Simulation to Deployment: Why Physical AI Matters
Artificial intelligence is moving beyond the screen. The attached presentation describes a shift from systems that generate text, images, and code to systems that can perceive their surroundings and take action. These systems could guide robots, vehicles, factory equipment, medical devices, and critical infrastructure.… Read More
TSMC OIP Ecosystem Forum 2026: Spotlight on Emerging Technologies
The TSMC OIP Ecosystem Forum highlighted many accomplishments across TSMC’s vast ecosystem. Specific achievements with TSMC as well as collaborative work across several companies were all on display.
And there was an exhibit area where you could meet the companies behind many of these stories and learn more about them.
This … Read More
TSMC’s AI Design Kit: Bringing Agentic AI Into Chip Design
TSMC is introducing an AI Design Kit, or ADK, to help artificial intelligence tools make better use of its semiconductor manufacturing knowledge. The idea is to give AI agents that run chip-design workflows a technology-specific foundation, so they can adjust designs toward performance, power and area targets with less manual… Read More
TSMC OIP Ecosystem Forum 2026: Broadcom’s View of ASICs and Ecosystems
I spent a significant part of my career in the ASIC business. This segment of semiconductors has always been challenging, difficult and invigorating. There is something special about delivering a working custom chip that enables your customer to bring a world-changing product to market. It has always been a highly competitive… Read More
SiFive and AMD Bring ROCm to RISC-V Datacenter Servers—and Why It Matters
SiFive and AMD demonstrated an AI workload that brings together two open technologies: the RISC-V processor architecture and AMD’s ROCm GPU software platform. At the AI Infra Summit on September 15, 2026, the companies showed ROCm 10.0 running on SiFive’s BigSky datacenter development server. SiFive P870-D CPUs served as the… Read More
TSMC OIP Ecosystem Forum 2026: Opening Remarks
The 2026 TSMC Open Innovation Platform (OIP) Ecosystem Forum was held on September 23, 2026, in Santa Clara, CA. This is the event where TSMC showcases the substantial progress made with its massive semiconductor ecosystem. As one would expect, AI was a key topic throughout the day, with some very impressive results reported and… Read More
Designing chips for the AI era: what TSMC’s roadmap means
About twenty years ago I worked with Cliff Hou, LC Lu, and the TSMC PDK team on reference flows with emerging EDA and IP companies. This was the precursor to the OIP. Having a person with LC Lu’s depth of R&D experience running the TSMC Design & Technology Platform is truly an honor, absolutely.
AI is creating two related… Read More


The silent killer of analog reliability: Why SPICE misses floating net