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When a Platform Provider Becomes a Competitor: Why Arm’s Silicon Strategy Changes the Incentives

When a Platform Provider Becomes a Competitor: Why Arm’s Silicon Strategy Changes the Incentives
by Admin on 04-07-2026 at 10:00 am

SemiWiki

Marc Evans, Director of Business Development & Marketing, Andes Technology USA

I work at a RISC-V IP company, and I genuinely root for Arm — probably more than most people in my position would admit. Not because I’m confused about who competes with whom, but because Arm’s best move for their shareholders is also… Read More


yieldWerx Delivers a Master Class in Co-Packaged Photonics Implementation

yieldWerx Delivers a Master Class in Co-Packaged Photonics Implementation
by Mike Gianfagna on 04-06-2026 at 10:00 am

yieldWerx Delivers a Master Class in Co Packaged Photonics Implementation

We all know the semiconductor industry is seeing a new era of data intensity. The industry’s response includes advanced semiconductor design strategies, the adoption of chiplets, and the integration of optical I/O and photonics to enable higher performance, faster AI computation, and increased modularity. Co-packaged photonics… Read More


Samtec’s Strong Presence at embedded world 2026

Samtec’s Strong Presence at embedded world 2026
by Mike Gianfagna on 04-03-2026 at 6:00 am

Samtec’s Strong Presence at embedded world 2026

The embedded world Exhibition & Conference recently concluded. The event is held annually in Nuremberg, Germany and has become one of the most influential gatherings for the global embedded systems community. Since its inception in 2003, the event has grown from a modest technical meeting into a large-scale international… Read More


Webinar – How to Reclaim Margin in Advanced Nodes

Webinar – How to Reclaim Margin in Advanced Nodes
by Mike Gianfagna on 04-02-2026 at 6:00 am

Webinar – How to Reclaim Margin in Advanced Nodes

This informative webinar discusses a significant issue that is cropping up for sub-5nm designs. As the graphic above shows, modeling uncertainty at advanced nodes results in excessive guard banding. These guard bands result in reduced performance and profit. A loss of 25 – 35% in PPA is discussed, along with the lost profit associated… Read More


RISC-V Now! — Where Specification Meets Scale!

RISC-V Now! — Where Specification Meets Scale!
by Daniel Nenni on 03-31-2026 at 8:00 am

RVN! 26 SemiWiki (400 x 400 px) (1)

In forty plus years as a semiconductor professional I have never seen a semiconductor design ecosystem build as fast and as strong as RISC-V. As a result, RISC-V Now! has emerged as a pivotal gathering, a conference with a clear and ambitious mission: To transform the open, modular, and flexible RISC-V ISA from an exciting specificationRead More


Sensors Converge: Where Intelligence Meets the Edge

Sensors Converge: Where Intelligence Meets the Edge
by Daniel Nenni on 03-29-2026 at 6:00 pm

Sensors Merge 2026 SemiWiki

The Sensors Converge Conference is one of the premier technical gatherings dedicated to the design, integration, and deployment of sensing technologies across industries. The event brings together engineers, system architects, researchers, and product developers to explore advancements in sensor hardware, edge computing,… Read More


Chemical Origins of Environmental Modifications to MOR Lithographic Chemistry

Chemical Origins of Environmental Modifications to MOR Lithographic Chemistry
by Daniel Nenni on 03-25-2026 at 10:00 am

Chemical Origins of Environmental Modifications to MOR Lithographic Chemistry

In the pursuit of advanced extreme ultraviolet (EUV) lithography for high-NA patterning, metal oxide resists (MORs) offer significant promise but face challenges like critical dimension (CD) variation due to atmospheric interactions. Presented at SPIE Advanced Lithography + Patterning 2025 by Kevin M. Dorney and colleagues… Read More


Arteris Highlights a Path to Scalable Multi-Die Systems at the Chiplet Summit

Arteris Highlights a Path to Scalable Multi-Die Systems at the Chiplet Summit
by Mike Gianfagna on 03-23-2026 at 6:00 am

Arteris Highlights a Path to Scalable Multi Die Systems at the Chiplet Summit

At the recent Chiplet Summit, presentations, discussions and general participation could be broken down into a few broad categories. There were presentations of actual chiplet designs, either as building blocks or end products. There were presentations regarding design tools and methodologies to support and accelerate … Read More


WEBINAR: Reclaiming Clock Margin at 3nm and Below

WEBINAR: Reclaiming Clock Margin at 3nm and Below
by Daniel Nenni on 03-19-2026 at 2:00 pm

Webinar Blog Image Reclaiming Clock Margin

At 3nm and below, clock networks have quietly become the dominant limiter of SoC power, performance, and yield. Yet most advanced-node designs still rely on abstraction-based signoff methodologies developed when voltage headroom was generous and interconnect effects were secondary.

That assumption no longer holds

As supply… Read More


Siemens Wins Best in Show Award at Chiplet Summit and Targets Broad 3D IC Design Enablement

Siemens Wins Best in Show Award at Chiplet Summit and Targets Broad 3D IC Design Enablement
by Mike Gianfagna on 03-19-2026 at 8:00 am

Siemens Wins Best in Show Award at Chiplet Summit and Targets Broad 3D IC Enablement

The recent Chiplet Summit in Santa Clara was buzzing with new designs and new design methods. It felt like the industry had turned a corner at this year’s event with lots of new technology and design success on display. Siemens EDA had a large presence at the show and took home the Best in Show Award for Packaging Design. There were a … Read More