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Arteris Highlights a Path to Scalable Multi-Die Systems at the Chiplet Summit

Arteris Highlights a Path to Scalable Multi-Die Systems at the Chiplet Summit
by Mike Gianfagna on 03-23-2026 at 6:00 am

Arteris Highlights a Path to Scalable Multi Die Systems at the Chiplet Summit

At the recent Chiplet Summit, presentations, discussions and general participation could be broken down into a few broad categories. There were presentations of actual chiplet designs, either as building blocks or end products. There were presentations regarding design tools and methodologies to support and accelerate … Read More


Siemens Wins Best in Show Award at Chiplet Summit and Targets Broad 3D IC Design Enablement

Siemens Wins Best in Show Award at Chiplet Summit and Targets Broad 3D IC Design Enablement
by Mike Gianfagna on 03-19-2026 at 8:00 am

Siemens Wins Best in Show Award at Chiplet Summit and Targets Broad 3D IC Enablement

The recent Chiplet Summit in Santa Clara was buzzing with new designs and new design methods. It felt like the industry had turned a corner at this year’s event with lots of new technology and design success on display. Siemens EDA had a large presence at the show and took home the Best in Show Award for Packaging Design. There were a … Read More


Verification Analytics: The New Paradigm with Cogita-PRO at DVCON 2026

Verification Analytics: The New Paradigm with Cogita-PRO at DVCON 2026
by Daniel Nenni on 03-18-2026 at 8:00 am

The Cogita PRO Paradigm

Cogita-PRO, developed by Vtool, introduces a transformative approach to design verification by treating it as a big data challenge rather than a traditional debugging exercise. Released in February 2026, this tool shifts the focus from manual log and waveform inspection to advanced verification analytics powered by data … Read More


TSMC Technology Symposium 2026: Advancing the Future of Semiconductor Innovation

TSMC Technology Symposium 2026: Advancing the Future of Semiconductor Innovation
by Daniel Nenni on 03-16-2026 at 10:00 am

TSMC Technology Symposium 2026

One of my favorite times of the year is coming (sailing season) and my favorite event of the year is coming as the company I most respect will host the best international semiconductor networking event starting here in Silicon Valley.

The 32nd annual TSMC Technology Symposium represents one of the most influential events in the … Read More


Synopsys Explores AI/ML Impact on Mask Synthesis at SPIE 2026

Synopsys Explores AI/ML Impact on Mask Synthesis at SPIE 2026
by Mike Gianfagna on 03-16-2026 at 6:00 am

Synopsys Explores AI:ML Impact on Mask Synthesis at SPIE 2026

The SPIE Advanced Lithography + Patterning Symposium recently concluded. This is a popular event where leading researchers gather. Challenges such as optical and EUV lithography, patterning technologies, metrology, and process integration for semiconductor manufacturing and adjacent applications are all covered. This… Read More


Unraveling Dose Reduction in Metal Oxide Resists via Post-Exposure Bake Environment

Unraveling Dose Reduction in Metal Oxide Resists via Post-Exposure Bake Environment
by Daniel Nenni on 03-15-2026 at 4:00 pm

Unraveling Dose Reduction in Metal Oxide Resists via Post Exposure Bake Environment

In the realm of extreme ultraviolet (EUV) lithography, metal oxide resists (MORs) have emerged as promising candidates for advanced semiconductor patterning. However, their stability poses challenges, particularly interactions with clean-room environments like humidity and airborne molecular contaminants (AMCs) … Read More


Agentic AI and the Future of Engineering

Agentic AI and the Future of Engineering
by Daniel Nenni on 03-13-2026 at 6:00 am

sassine announces agentic ai hires converge 2026

Agentic AI emerges in this Synopsys Converge keynote not as a futuristic add-on, but as a practical response to the growing complexity of engineering. In the speaker’s view, the traditional way of designing chips, systems, and intelligent products is no longer sufficient for the era of physical AI. Engineers are now dealing with… Read More


Ravi Subramanian on Trends that are Shaping AI at Synopsys

Ravi Subramanian on Trends that are Shaping AI at Synopsys
by Daniel Nenni on 03-12-2026 at 8:00 am

Ravi Interview Synopsys Converge

Right before the Synopsys Converge Keynote I caught an interview with Ravi Subramanian, Chief Product Management Officer at Synopsys, which highlights several important trends shaping the future of AI, semiconductor technology, and engineering. His discussion focuses on how the worlds of silicon design and system engineering… Read More


Qnity and Silicon Catalyst Light a Path to Success at the Chiplet Summit

Qnity and Silicon Catalyst Light a Path to Success at the Chiplet Summit
by Mike Gianfagna on 03-11-2026 at 10:00 am

Qnity and Silicon Catalyst Light a Path to Success at the Chiplet Summit

The Chiplet Summit recently concluded. Multi-die heterogeneous design is a hot topic these days and chiplets are a key enabler for this trend. The conference was noticeably larger this year. There were many presentations and exhibits that focused on areas such as how to design chiplets, what standards are important, how to integrate… Read More


The Evolution of RISC-V and the Role of Andes Technology in Building a Global Ecosystem

The Evolution of RISC-V and the Role of Andes Technology in Building a Global Ecosystem
by Daniel Nenni on 03-09-2026 at 10:00 am

RISC V Now Andes Conference

During my frequent trips to Taiwan as a foundry relationship professional I remember meeting Frankwell Lin, CEO of Andes, in Taiwan 15+ years ago. As I walked to TSMC HQ from the Hotel Royal (my second home for many years) Andes was about mid point and Frankwell’s door was always open. Sometimes just tea, sometimes technology,… Read More