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During my frequent trips to Taiwan as a foundry relationship professional I remember meeting Frankwell Lin, CEO of Andes, in Taiwan 15+ years ago. As I walked to TSMC HQ from the Hotel Royal (my second home for many years) Andes was about mid point and Frankwell’s door was always open. Sometimes just tea, sometimes technology,… Read More
In the rapidly evolving landscape of semiconductor technology, the Universal Chiplet Interconnect Express (UCIe) emerges as a groundbreaking open standard designed to revolutionize on-package chiplet integrations. Presented by Dr. Debendra Das Sharma, Chair of the UCIe Consortium and Intel Senior Fellow, at the Chiplet… Read More
The recent Chiplet Summit at the Santa Clara Convention Center was buzzing with many enabling technologies for chiplet-based design. Collaboration was also on display during many parts of the show. A presentation in the Siemens booth was a perfect example of both of those trends. In the Siemens booth, Perforce presented an excellent… Read More
The rapid evolution of automotive technology has intensified the demand for highly reliable, high-performance semiconductor memory solutions. Modern vehicles increasingly rely ADAS driving features, and complex infotainment platforms, all of which require memory that can operate flawlessly under extreme environmental… Read More
At the 2026 Chiplet Summit, Synopsys presented a bold vision for the future of semiconductor innovation: AI-driven multi-die design powered by agentic intelligence. As the semiconductor industry shifts rapidly toward chiplet-based architectures and 3D stacking, the complexity of design, verification, and system integration… Read More
The upcoming webinar “Intelligent Networks: Power, Reliability, and Maintenance in Telecom” will focus on how telecommunications networks are adapting to growing demands for efficiency, resilience, and scalability. As telecom operators expand 5G deployments, integrate cloud-native architectures, and prepare for AI-driven… Read More
In the rapidly evolving world of artificial intelligence and semiconductor design, open-standard processor architectures are gaining unprecedented traction. At the center of this shift is SiFive, a company founded by the original creators of the RISC-V ISA, which champions an open, extensible, and license-free alternative… Read More
The Field-Effect Transistor (FET), a cornerstone of modern electronics, marks its centennial in 2025, tracing back to Julius Edgar Lilienfeld’s groundbreaking invention in 1925. Born in 1882 in what is now Lviv, Ukraine, Lilienfeld was a prolific physicist who earned his PhD from Berlin University in 1905. His early … Read More
As I’ve discussed before, Samtec has a way of dominating every trade show the company participates in. The upcoming DesignCon event is no exception. At the show, Samtec will be discussing data rates up to 448 Gbps and signals up to 130 GHz. Beyond a rich set of demonstrations in the company’s booth, Samtec engineers will be participating… Read More
The rapid evolution of semiconductor design has elevated chiplets from a niche concept to a foundational strategy for next-generation computing. At the upcoming Chiplet Summit – February 17–19, 2026 Santa Clara Convention Center. Silicon Catalyst will play a central role in shaping this conversation, highlighting… Read More
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CEO Interview with Jerome Paye of TAU Systems