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In today’s rapidly evolving digital landscape, the security of electronic systems is of the highest priority. This importance is underscored by technological advancements and increasing regulatory demands. Multi-die designs which integrate multiple dies (also called chiplets) into a single package, introduce … Read More
In part one of this webinar series, Keysight and Modelithics looked at the use of 3D passive vendor component models supporting highly accurate, automated 3D EM-circuit co-simulation of high-frequency RF board designs. Part two continues the exploration of RF board design flows for simulating active circuits on boards, again… Read More
The 2025 Design and Verification Conference (DVCon) was a four-day event packed with insightful discussions, cutting-edge technology showcases, and thought-provoking debates. The conference agenda included a rich mix of tutorial sessions, a keynote presentation, a panel discussion, and an exhibit hall with Electronic… Read More
Traditional RF board design strategies based on circuit simulation worked at lower frequencies and relatively large spacing between components. Higher frequencies and densification dominate RF designs now, where corresponding wider bandwidths and tighter layouts with closely spaced components produce more complex 3D… Read More
There were many announcements and significant demonstrations of new technology at the recent DesignCon. The show celebrated its 30th anniversary this year and it has grown quite a bit. As in past years Samtec had a commanding presence at the show. There will be more about that in a moment, but first I want to focus on a substantial … Read More
The exponential growth of cloud data centers is well-known. Driven by the demands of massive applications like generative AI, state-of-the-art data centers present substantial challenges in terms of power consumption. And AI is poised to drive a 160% increase in data center power demand while also increasing demands on storage… Read More
The growing demand for high-performance AI applications continues to drive innovation in CPU architecture design. As machine learning workloads, particularly convolutional neural networks (CNNs), become more computationally intensive, architects face the challenge of delivering performance improvements while maintaining… Read More
The lifecycle for complex chip design includes many factors. Traditional systems focus on design tasks, associated schedules and manufacturing logistics. While these are important aspects of the project there is a lot more that can be measured, predicted and tracked. Taking a more holistic view of the project opens new opportunities… Read More
CES 2025 was held last week in Las Vegas. We at Semiconductor Intelligence attended for our tenth CES. The event had over 140,000 attendees and over 4,500 exhibitors.
U.S. Consumer Electronics Market
Brian Comiskey of the Consumer Technology Association (CTA) presented on technology trends in 2025. The key theme was advances… Read More
Chiplets continue gaining momentum, fueled in large part by applications for AI and 5G/6G RFICs. Keysight has a strong presence at this year’s Chiplet Summit in Santa Clara, which includes Simon Rance in a super panel discussing “Chiplets: The Key to Solving the AI Energy Gap” and Nilesh Kamdar with a keynote… Read More
Alphawave Semi is in Play!