You are currently viewing SemiWiki as a guest which gives you limited access to the site. To view blog comments and experience other SemiWiki features you must be a registered member. Registration is fast, simple, and absolutely free so please,
join our community today!
WP_Term Object
(
[term_id] => 159
[name] => Siemens EDA
[slug] => siemens-eda
[term_group] => 0
[term_taxonomy_id] => 159
[taxonomy] => category
[description] =>
[parent] => 157
[count] => 804
[filter] => raw
[cat_ID] => 159
[category_count] => 804
[category_description] =>
[cat_name] => Siemens EDA
[category_nicename] => siemens-eda
[category_parent] => 157
[is_post] =>
)
WP_Term Object
(
[term_id] => 159
[name] => Siemens EDA
[slug] => siemens-eda
[term_group] => 0
[term_taxonomy_id] => 159
[taxonomy] => category
[description] =>
[parent] => 157
[count] => 804
[filter] => raw
[cat_ID] => 159
[category_count] => 804
[category_description] =>
[cat_name] => Siemens EDA
[category_nicename] => siemens-eda
[category_parent] => 157
[is_post] =>
)
Dan is joined by Marc Hutner. Marc has been innovating in the areas of design, test, DFT and data analytics for more than 20 years. In June of 2023, he joined the Siemens EDA Tessent group as the product director of Silicon Learning, enabling how silicon data is applied to yield improvement and silicon debug. Previously, he worked … Read More
The week before DAC I had the privilege to take a video call with Pradeep Thiagarajan – Product Manager, Simulation, Custom IC Verification at Siemens EDA to get an update on new simulation products. I’ve been following Solido for years now and knew that they were an early adopter of ML for Monte Carlo simulations with SPICE users.… Read More
Dan is joined by Sathishkumar Balasubramanian. Sathish currently leads the product management and marketing organization for CustomIC Verification (CICV) division at Siemens. Sathish is an experienced product leader with over 20+ years of experience in the EDA industry.
Sathish’s focus is on bringing value to the semiconductor… Read More
Heterogeneous multi-die integration is gaining more momentum all the time. The limited roadmap offered by Moore’s Law monolithic, single-die integration has opened the door to a new era of more-than-Moore heterogeneous integration. The prospects offered by this new design paradigm are exciting and the entire ecosystem is… Read More
An emerging trend with IC design is the growing use of chiplets and even 3D IC designs, as the disaggregated approach has some economic and performance benefits over a single SoC. There are thermal challenges with using chiplets and 3D IC designs, so that means that thermal analysis has become more important. I just spoke with Michael… Read More
Dan is joined by Dr. John Ferguson, senior director of marketing for the Calibre product line at Siemens EDA. John has worked extensively in physical design verification. Current activities include efforts to extend physical verification and PDK enablement for 3DIC design and silicon photonics.
Dan explores the Siemens EDA… Read More
Visitors to Siemens’ booth (#2521) at the 61st Design Automation Conference (DAC) will see on display the Veloce™ CS system that unifies hardware emulation, enterprise prototyping and software prototyping into one hardware-assisted verification and validation platform.
The display will feature the three single-blade … Read More
As SoC complexities continue to expand to billions of transistors, the quest for higher levels of design automation also rises. This has led to the adoption of High-Level Synthesis (HLS), using design languages such as C++ and SystemC, which is more productive than traditional RTL design entry methods. In the RTL approach there… Read More
At the recent User2user conference, Amit Kumar, Principal Hardware Engineer, Microsoft, shared the company’s experience from building a 3DIC SoC and highlighted Siemens EDA tools that were used. The following is a synthesis of core aspects of that talk.
3DIC Challenges
Despite the numerous advantages of 3DIC technology, its… Read More
PCB designers have been using manual routing for decades now, so when is it time to consider adding interactive routing technologies to become more productive? Manually routing traces to connect components will take time from a skilled team member and involves human judgement that will introduce errors. When a design change … Read More
