WP_Term Object
(
    [term_id] => 159
    [name] => Siemens EDA
    [slug] => siemens-eda
    [term_group] => 0
    [term_taxonomy_id] => 159
    [taxonomy] => category
    [description] => 
    [parent] => 157
    [count] => 752
    [filter] => raw
    [cat_ID] => 159
    [category_count] => 752
    [category_description] => 
    [cat_name] => Siemens EDA
    [category_nicename] => siemens-eda
    [category_parent] => 157
    [is_post] => 
)
            
Q2FY24TessentAI 800X100
WP_Term Object
(
    [term_id] => 159
    [name] => Siemens EDA
    [slug] => siemens-eda
    [term_group] => 0
    [term_taxonomy_id] => 159
    [taxonomy] => category
    [description] => 
    [parent] => 157
    [count] => 752
    [filter] => raw
    [cat_ID] => 159
    [category_count] => 752
    [category_description] => 
    [cat_name] => Siemens EDA
    [category_nicename] => siemens-eda
    [category_parent] => 157
    [is_post] => 
)

Analysis and Verification of Single Event Upset Mitigation

Analysis and Verification of Single Event Upset Mitigation
by Jacob Wiltgen on 12-07-2023 at 10:00 am

Figure 1 Driving trends

The evolution of space-based applications continues to drive innovation across government and private entities. The new demands for advanced capabilities and feature sets have a direct impact on the underlying hardware, driving companies to migrate to smaller geometries to deliver the required performance, area, and power… Read More


SystemVerilog Has Some Changes Coming Up

SystemVerilog Has Some Changes Coming Up
by Daniel Payne on 11-29-2023 at 10:00 am

SystemVerilog - extending coverpoints

SystemVerilog came to life in 2005 as a superset of Verilog-2005. The last IEEE technical committee revision of the SystemVerilog LRM was completed in 2016 and published as IEEE 1800-2017.

Have the last seven years revealed any changes or enhancements that maintain SystemVerilog’s relevance and efficaciousness in the face … Read More


A Complete Guidebook for PCB Design Automation

A Complete Guidebook for PCB Design Automation
by Kalar Rajendiran on 11-29-2023 at 8:00 am

Constraint Management

Printed Circuit Boards (PCBs) are the foundation of modern electronics, and designing them efficiently is complex. Design automation and advanced PCB routing have transformed the process, making it faster and more reliable. Design automation streamlines tasks, reduces errors, and ensures consistency. Advanced PCB routing… Read More


Siemens Digital Industries Software Collaborates with AWS and Arm To Deliver an Automotive Digital Twin

Siemens Digital Industries Software Collaborates with AWS and Arm To Deliver an Automotive Digital Twin
by Mike Gianfagna on 11-28-2023 at 6:00 am

Siemens Digital Industries Software Collaborates with AWS and ARM To Deliver an Automotive Digital Twin

 

According to McKinsey & Company, a digital twin is a digital representation of a physical object, person, or process, contextualized in a digital version of its environment. Digital twins can help an organization simulate real situations and their outcomes, ultimately allowing it to make better decisions. Anyone… Read More


Handling metastability during Clock Domain Crossing (CDC)

Handling metastability during Clock Domain Crossing (CDC)
by Daniel Payne on 11-22-2023 at 10:00 am

synchronizer min

SoC designs frequently have lots of different clock domains to help manage power more efficiently, however one side effect is that when the clock domains meet, i.e., in a Clock Domain Crossing (CDC), there’s the possibility of setup and hold time violations that can cause a flip-flop to become metastable. Synchronizer … Read More


Uniquely Understanding Challenges of Chip Design and Verification

Uniquely Understanding Challenges of Chip Design and Verification
by Daniel Nenni on 11-14-2023 at 6:00 am

Jean Marie Brunet (1)

Jean-Marie Brunet is Vice President and General Manager of Siemens Hardware-Assisted Verification. He and I spoke recently about how different his hardware group is from the rest of the software-centric EDA product space and why a hardware-oriented EDA vendor like Siemens fully understands the challenges of the chip design… Read More


Successful 3DIC design requires an integrated approach

Successful 3DIC design requires an integrated approach
by Kalar Rajendiran on 11-13-2023 at 6:00 am

Siemens EDA 3DIC Graphics

While the leap from traditional SoC/IC designs to Three-Dimensional Integrated Circuits (3DICs) designs brings new benefits and opportunities, it also introduces new challenges. The benefits include performance, power efficiency, footprint reduction and cost savings. The challenges span design, verification, thermal… Read More


Make Your RISC-V Product a Fruitful Endeavor

Make Your RISC-V Product a Fruitful Endeavor
by Daniel Nenni on 11-06-2023 at 6:00 am

RISC V Chip

Consider RISC-V ISA as a new ‘unforbidden fruit’. Unlike other fruits (ISAs) that grow in proprietary orchards, RISC-V is available to all, i.e. open-source. Much like a delicious fruit can be transformed into a wide array of delectable desserts, so can RISC-V be utilized to create a plethora of effective applications across … Read More


Ensuring 3D IC Semiconductor Reliability: Challenges and Solutions for Successful Integration

Ensuring 3D IC Semiconductor Reliability: Challenges and Solutions for Successful Integration
by Kalar Rajendiran on 10-25-2023 at 10:00 am

3D IC Cross Section Illustration

One of the most promising advancements in the semiconductor field is the development of 3D Integrated Circuits (3D ICs). 3D ICs enable companies to partition semiconductor designs and seamlessly integrate silicon Intellectual Property (IP) at the most suitable process nodes and processes. This strategic partitioning yields… Read More


The Path to Chiplet Architecture

The Path to Chiplet Architecture
by Paul McLellan on 10-19-2023 at 10:00 am

The Path to Chiplet Architecture

If you have anything to do with the semiconductor industry, you already know that one of the hottest areas for both manufacturing and EDA are systems designed with advanced packaging, basically putting more than one die (aka chiplets) in the same package.

When 3D packaging was first introduced, there were not really any effective… Read More