You are currently viewing SemiWiki as a guest which gives you limited access to the site. To view blog comments and experience other SemiWiki features you must be a registered member. Registration is fast, simple, and absolutely free so please,
join our community today!
WP_Term Object
(
[term_id] => 159
[name] => Siemens EDA
[slug] => siemens-eda
[term_group] => 0
[term_taxonomy_id] => 159
[taxonomy] => category
[description] =>
[parent] => 157
[count] => 830
[filter] => raw
[cat_ID] => 159
[category_count] => 830
[category_description] =>
[cat_name] => Siemens EDA
[category_nicename] => siemens-eda
[category_parent] => 157
[is_post] =>
)
WP_Term Object
(
[term_id] => 159
[name] => Siemens EDA
[slug] => siemens-eda
[term_group] => 0
[term_taxonomy_id] => 159
[taxonomy] => category
[description] =>
[parent] => 157
[count] => 830
[filter] => raw
[cat_ID] => 159
[category_count] => 830
[category_description] =>
[cat_name] => Siemens EDA
[category_nicename] => siemens-eda
[category_parent] => 157
[is_post] =>
)
This is a live panel with industry experts who are on the leading edge of AI in semiconductor manufacturing. This is a must attend event for all levels of semiconductor professionals. I hope to see you there.
The semiconductor industry faces unprecedented challenges as it pushes toward advanced nodes below 3nm, managing exponential… Read More
Review the specifications of any state-of-the-art microcontroller and you will discover the high dynamic current the device can consume. Examining the high clock rates and low tolerable voltage drop will lead you to the all-important power delivery network, or PDN. Components here include power planes, layer stack-up, decoupling… Read More
The recent Chiplet Summit in Santa Clara was buzzing with new designs and new design methods. It felt like the industry had turned a corner at this year’s event with lots of new technology and design success on display. Siemens EDA had a large presence at the show and took home the Best in Show Award for Packaging Design. There were a … Read More
Though terminology sometimes get fuzzy, consensus holds that an agent manages a bounded task with control through a natural language interface. An agentic orchestrator, itself an agent, manages a more complex objective requiring reasoning through multi-step actions and is responsible for orchestrating those actions. By… Read More
As semiconductor manufacturing pushes deeper into the nanometer regime, computational lithography has evolved from a supporting step into a central pillar of advanced chip design. Mask synthesis, lithography simulation, and optical proximity correction (OPC) now demand unprecedented levels of accuracy and computational… Read More
How do I know when my hardware design is correct and meets all of the specifications? For many years the answer was simple, simulate as much as you can in the time allowed in the schedule and then hope for the best when silicon arrives for testing. There is a complementary method for ensuring that hardware design meets the specifications… Read More
The semiconductor industry is experiencing unprecedented growth in complexity as advanced process nodes, heterogeneous integration, and AI-driven workloads demand increasingly sophisticated chip designs. At the same time, semiconductor companies face rising design costs, increasing engineering workloads, and a shrinking… Read More
There’s no denying that verification now leads the field in agentic AI announcements, accelerating the trend around this significant contribution to design automation. Siemens have just announced their Questa One Agentic Toolkit, their response to this trend, building on the core Questa One platform. Questa One provides … Read More
Safety engineers, hardware designers and reliability specialists in safety-critical industries like automotive, aerospace, medical device and industrial automation use FMEDA (Failure Modes, Effects and Diagnostic Analysis). ISO 26262 compliance for ADAS, braking systems and ECUs require FMEDA in the automotive sector.… Read More
The recent Chiplet Summit at the Santa Clara Convention Center was buzzing with many enabling technologies for chiplet-based design. Collaboration was also on display during many parts of the show. A presentation in the Siemens booth was a perfect example of both of those trends. In the Siemens booth, Perforce presented an excellent… Read More