The semiconductor industry is entering a transformative new phase, driven by the convergence of artificial intelligence, cloud computing, and increasingly complex chip architectures. That message took center stage during the keynote talks at the Siemens EDA User2User 2026 North America conference. Executives from Siemens,… Read More
Library Characterization gets a Boost from AI
The semiconductor industry creates increasingly complex SoC and chiplets using lots of IP and all of that IP needs to be characterized at the cell level. As we design with 3nm and 2nm nodes, the sheer volume of data required for accurate static timing analysis (STA) is greatly increasing. Modern design flows rely on characterized… Read More
Europe is Getting Serious About ASIC Innovation
I was born in the UK (then still a part of Europe), so always eager to see them succeed. But I must admit that past behavior has reinforced the view that the EU’s only active “contribution” to progress is regulation. However this seems to be changing in multiple interesting ways. On a grand scale, the Nordic economic model is taking … Read More
Siemens EDA Expands AI and Advanced Packaging Collaboration with TSMC
At the recent TSMC Technology Symposium 2026, Siemens EDA reinforced its position as one of the key ecosystem partners supporting TSMC in the race toward AI-driven semiconductor design, advanced packaging, and next-generation process technologies. The annual forum has become one of the semiconductor industry’s most important… Read More
A Different Angle on Co-Simulation for Systems
Co-simulation, two or more simulations running concurrently in some manner, is not a new idea. I have written before about multiphysics systems able to model thermal, stress, CFD and other factors simultaneously. I just read a white paper from Siemens based on a different method, using an open standard called the Functional Mockup… Read More
Siemens U2U 3D IC Design and Verification Panel
Given the success of the event in Silicon Valley last week, I would expect the Siemens U2U event in Munich to be even bigger. In my experience this has been the best user driven event in 2026 with the deepest customer content. EDA has always been a customer driven industry and it is good to see us recognize that from time to time. Kalar … Read More
Solving the EDA tool fragmentation crisis
By Samar Abd El-Hady and Wael ElManhawy
Design teams today face an uncomfortable truth: the specialized tools they need to verify modern ICs can’t reliably share the same design data. As geometries shrink below five nanometers and designs incorporate billions of transistors across multiple dies, no single Electronic… Read More
Complex PCB signoff challenges
Many complex PCB designs have high data-rate signals like USB, PCIe, DDR and HDMI which call for more thorough verification methods to ensure compliance plus mitigate any signal integrity, power integrity and EMI/EMC issues. Siemens has a methodology that uses automated rule-based electrical verification with an EDA tool,… Read More
WEBINAR: Beyond Moore’s Law and The Future of Semiconductor Manufacturing Intelligence
This is a live panel with industry experts who are on the leading edge of AI in semiconductor manufacturing. This is a must attend event for all levels of semiconductor professionals. I hope to see you there.
The semiconductor industry faces unprecedented challenges as it pushes toward advanced nodes below 3nm, managing exponential… Read More
Exploring the Hidden Complexity of Modern Power Electronics Design – A Siemens White Paper
Review the specifications of any state-of-the-art microcontroller and you will discover the high dynamic current the device can consume. Examining the high clock rates and low tolerable voltage drop will lead you to the all-important power delivery network, or PDN. Components here include power planes, layer stack-up, decoupling… Read More

