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Siemens has EDA tools and flows, NVIDIA has AI infrastructure, so what happens when these two companies collaborate? I’m at DAC 2026 and all the buzz this year is Agentic AI, so an came out on Sunday evening about how semiconductor and PCB design flows are being improved by this teamwork. Amit Gupta from Siemens and Timothy Costa from… Read More
NVIDIA’s expansion of the NVIDIA Agent Toolkit with PhysicsNeMo and CUDA-X libraries marks a shift from general-purpose AI assistants toward autonomous engineering systems. Instead of limiting agents to document retrieval, code generation, or workflow automation, the expanded toolkit lets developers connect reasoning… Read More
By Mauli Shah, Product Engineer, Siemens
Analog and mixed-signal design teams face a persistent challenge that directly impacts tape-out schedules and project predictability: symmetry violations discovered at signoff trigger expensive respins, delay schedules and create unpredictable iteration cycles. Despite symmetry… Read More
Daniel is joined by Sagar Saxena, Senior Product Engineer at Siemens EDA specializing in computational lithography, optical proximity correction (OPC), and advanced patterning solutions for leading-edge semiconductor manufacturing. Sagar has led the development and deployment of advanced OPC technologies, including… Read More
As systems become increasingly complex across every field of science and engineering, the importance of computer simulation in design, analysis, and verification continues to increase over time. The traditional process in which a system is modeled and simulated in a single tool is called monolithic simulation. On the other… Read More
As semiconductor manufacturing pushes toward advanced nodes with tighter feature sizes, the optical proximity correction (OPC) workflow is adopting curvilinear masks to achieve the larger process windows that traditional Manhattan geometries cannot deliver.
Traditional Manhattan masks constrain shapes to vertical … Read More
The semiconductor industry is entering a transformative new phase, driven by the convergence of artificial intelligence, cloud computing, and increasingly complex chip architectures. That message took center stage during the keynote talks at the Siemens EDA User2User 2026 North America conference. Executives from Siemens,… Read More
The semiconductor industry creates increasingly complex SoC and chiplets using lots of IP and all of that IP needs to be characterized at the cell level. As we design with 3nm and 2nm nodes, the sheer volume of data required for accurate static timing analysis (STA) is greatly increasing. Modern design flows rely on characterized… Read More
I was born in the UK (then still a part of Europe), so always eager to see them succeed. But I must admit that past behavior has reinforced the view that the EU’s only active “contribution” to progress is regulation. However this seems to be changing in multiple interesting ways. On a grand scale, the Nordic economic model is taking … Read More
At the recent TSMC Technology Symposium 2026, Siemens EDA reinforced its position as one of the key ecosystem partners supporting TSMC in the race toward AI-driven semiconductor design, advanced packaging, and next-generation process technologies. The annual forum has become one of the semiconductor industry’s most important… Read More
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