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Daniel is joined by John Ferguson, senior director of product management for the Calibre products in the 3DIC space at Siemens EDA. He manages the vision and product offerings in the Calibre domain for 3DIC design solutions.
Dan explores the challenges of 3DIC and chiplet-based design with John, who describes the broad range of… Read More
By Dina Medhat
Three key takeaways
High-speed signals enable electronic systems by using memory interfaces, SerDes channels, data center backplanes and connectivity in automobiles. Challenges arise from signal distortions like inter-symbol interference, channel loss and dispersion effects. Multi-gigabit data transfer rates in High-Bandwidth Memory… Read More
Siemens recently released a white paper on a methodology to enhance test coverage for designs with tight DPPM requirements. I confess when I first skimmed the paper, I thought this was another spin on fault simulation for ASIL A-D qualification, but I was corrected and now agree that while there are some conceptual similarities… Read More
In the rapidly evolving semiconductor industry, Design Rule Checking (DRC) remains a critical bottleneck in chip design workflows. Siemens EDA’s presentation at the 2025 TSMC Open Innovation Platform Forum, titled “AI-Driven DRC Productivity Optimization,” showcases how artificial intelligence … Read More
At times it has seemed like any development in EDA had to build a GenAI app that would catch the attention of Wall Street. Now I see more attention to GenAI being used for less glamorous but eminently more practical advances. This recent white paper from Siemens on how to help verification engineers get up to speed faster with PSS is … Read More
In the competitive vertical of mobile System-on-Chip development, SRAM plays a pivotal role, occupying nearly 40% of chip area and directly impacting yield and performance. The presentation “Accelerating SRAM Design Cycles With Additive AI Technology,” co-delivered by Mohamed Atoua of Siemens EDA and Deepesh… Read More
SoC projects are running behind schedule as design and verification complexity has increased dramatically, so just adding more engineers, more tests and more compute aren’t the answer. The time is ripe to consider smarter ways to improve verification efficiency. The added complexity of multiple embedded processors, multiple… Read More
By Niranjan Sitapure
Artificial intelligence (AI) is reshaping industries worldwide. Consumer-grade AI solutions are getting significant attention in the media for their creativity, speed, and accessibility—from ChatGPT and Meta’s AI app to Gemini for image creation, Sora for video, Sona for music, and Perplexity for web… Read More
By Todd Burkholder and Per Viklund, Siemens EDA
The landscape of advanced IC packaging is rapidly evolving, driven by the imperative to support innovation on increasingly complex and high-capacity products. The broad industry trend toward heterogeneous integration of diverse die and chiplets into advanced semiconductor… Read More
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