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Q2FY24TessentAI 800X100
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Hierarchically defining bump and pin regions overcomes 3D IC complexity

Hierarchically defining bump and pin regions overcomes 3D IC complexity
by Admin on 11-13-2025 at 8:00 am

connectivity in a hierarchical IC package floorplan

By Todd Burkholder and Per Viklund, Siemens EDA

The landscape of advanced IC packaging is rapidly evolving, driven by the imperative to support innovation on increasingly complex and high-capacity products. The broad industry trend toward heterogeneous integration of diverse die and chiplets into advanced semiconductor… Read More


CDC Verification for Safety-Critical Designs – What You Need to Know

CDC Verification for Safety-Critical Designs – What You Need to Know
by Mike Gianfagna on 11-13-2025 at 6:00 am

CDC Verification for Safety Critical Designs – What You Need to Know

Verification is always a top priority for any chip project. Re-spins result in lost time-to-market and significant cost overruns. Chip bugs that make it to the field present another level of lost revenue, lost brand confidence and potential costly litigation. If the design is part of the avionics or control for an aircraft, the… Read More


A Compelling Differentiator in OEM Product Design

A Compelling Differentiator in OEM Product Design
by Bernard Murphy on 11-05-2025 at 6:00 am

PartQuest

Jennifer, an OEM hardware designer, is planning a product around a microcontroller she thinks will meet her needs and wants to supply power from a 3V coin cell battery which she must connect though a boost controller. Jennifer searches a rough description of the part she needs, generating a long list of component manufacturers … Read More


AI-Driven DRC Productivity Optimization: Revolutionizing Semiconductor Design

AI-Driven DRC Productivity Optimization: Revolutionizing Semiconductor Design
by Daniel Nenni on 10-28-2025 at 10:00 am

AI Driven DRC Productivity Optimization Siemens AMD TSMC

The semiconductor industry is undergoing a transformative shift with the integration of AI into DRC workflows, as showcased in the Siemens EDA presentation at the 2025 TSMC OIP. Titled “AI-Driven DRC Productivity Optimization,” this initiative, led by Siemens EDA’s David Abercrombie alongside AMD’s… Read More


Visualizing hidden parasitic effects in advanced IC design 

Visualizing hidden parasitic effects in advanced IC design 
by Admin on 10-15-2025 at 10:00 am

[white paper] Parasitic Analysis Figures

By Omar Elabd

As semiconductor designs move below 7 nm, parasitic effects—resistance, capacitance and inductance—become major threats to IC performance and reliability, often hiding where netlist reviews cannot reach. Design teams need advanced visualization tools like heat maps, layer-based analysis and direct layout… Read More


Protect against ESD by ensuring latch-up guard rings

Protect against ESD by ensuring latch-up guard rings
by Admin on 10-13-2025 at 10:00 am

fig1 latchup event

By Mark Tawfik

Overview: Protecting ICs from costly ESD and latch-up failures

Electrostatic discharge (ESD) events cost the semiconductor industry an estimated $8 billion annually in lost productivity, warranty claims and product failures [1].

Ensuring the robust protection of integrated circuits (ICs) against various… Read More


Something New in Analog Test Automation

Something New in Analog Test Automation
by Daniel Payne on 09-16-2025 at 10:00 am

IJTAG min

Digital design engineers have used DFT automation technologies like scan and ATPG for decades now, however, analog blocks embedded within SoCs have historically required that a test engineer write tests that require specialized expertise and that can take man-months to debug. Siemens has a long history in the DFT field, SPICE… Read More


Tessent MemoryBIST Expands to Include NVRAM

Tessent MemoryBIST Expands to Include NVRAM
by Mike Gianfagna on 09-10-2025 at 10:00 am

Tessent MemoryBIST Expands to Include NVRAM

The concept of built-in self-test for electronics has been around for a while. An article in Electronic Design from 1996 declared that, “built-in self-test (BIST) is nothing new.” The memory subsystem is a particularly large and complex part of any semiconductor design, and it’s one that can be particularly vexing to test. Design… Read More


Smart Verification for Complex UCIe Multi-Die Architectures

Smart Verification for Complex UCIe Multi-Die Architectures
by Admin on 09-08-2025 at 10:00 am

Figure 1

By Ujjwal Negi – Siemens EDA

Multi-die architectures are redefining the limits of chip performance and scalability through the integration of multiple dies into a single package to deliver unprecedented computing power, flexibility, and efficiency. At the heart of this transformation is the Universal Chiplet Interconnect… Read More


Orchestrating IC verification: Harmonize complexity for faster time-to-market

Orchestrating IC verification: Harmonize complexity for faster time-to-market
by Admin on 09-01-2025 at 6:00 am

fig1 optimize ic with mjs

By Marko Suominen and Slava Zhuchenya of Siemens Digital Industries Software.

It’s often said that an orchestra without a conductor is just a collection of talented individuals making noise. The conductor’s role is to transform that potential cacophony into a unified, beautiful symphony. The same concept holds… Read More