Modern chip design verification often encounters challenges when connecting peripherals, primarily due to drastic differences in operating speed or hardware limitations. Designs running on hardware emulators or FPGA prototyping platforms typically operate at clock frequencies of tens of megahertz, and in some cases even… Read More
Author: Daniel Nenni
FPGA Prototyping in Practice: Addressing Peripheral Connectivity Challenges
CEO Interview with Dr. Peng Zou of PowerLattice
Dr. Zou is one of the industry’s leading experts in power delivery for high performance processors. Before founding PowerLattice, he held technical leadership roles at Qualcomm/NUVIA, Huawei and Intel, where he led the multidisciplinary teams advancing integrated voltage regulator technologies across magnetic materials,… Read More
Silicon Catalyst on the Road to $1 Trillion Industry
There were quite a few announcements at the Silicon Catalyst event at the Computer History Museum last week. The event itself was eventful with semiconductor legends in the audience and on the stage. First let’s talk about the announcements Silicon Catalyst made then we will talk about the event itself.
In addition to expanding… Read More
Ceva Unleashes Wi-Fi 7 Pulse: Awakening Instant AI Brains in IoT and Physical Robots
In the rapidly evolving landscape of connected devices, where artificial intelligence meets the physical world, Ceva has unveiled a groundbreaking solution: the Ceva-Waves Wi-Fi 7 1×1 client IP. Announced on October 21, 2025, this IP core is designed to supercharge AI-enabled IoT devices and pioneering physical AI systems,… Read More
Semidynamics Inferencing Tools: Revolutionizing AI Deployment on Cervell NPU
In the fast-paced world of AI development, bridging the gap from trained models to production-ready applications can feel like an eternity. Enter Semidynamics’ newly launched Inferencing Tools, a game-changing software suite designed to slash deployment times on the company’s Cervell RISC-V Neural Processing… Read More
WEBINAR: How PCIe Multistream Architecture is Enabling AI Connectivity
In the race to power ever-larger AI models, raw compute is only half the battle. The real challenge lies in moving massive datasets between processors, accelerators, and memory at speeds that keep up with trillion-parameter workloads. Synopsys tackles this head-on with its webinar, How PCIe Multistream Architecture is Enabling… Read More
CEO Interview with Roy Barnes of TPC
Roy Barnes is the group president of The Partner Companies (TPC), a specialty manufacturer, overseeing TPC’s photochemical etching companies: Elcon, E-Fab, Fotofab, Microphoto and PEI.
Roy is an experienced leader known for building strong teams, driving change and inspiring people to succeed. Throughout his career, he … Read More
CEO Interview with Mr. Shoichi Teshiba of Macnica ATD
With over 30 years of experience in sales and marketing of semiconductors and electronic components, Mr. Shoichi Teshiba has worked across a broad range of industries including storage, servers, networking, consumer electronics, industrial equipment, and automotive. Combining deep insight into both domestic and global… Read More
TSMC Kumamoto: Pioneering Japan’s Semiconductor Revival
In the lush landscapes of Kumamoto Prefecture, on Japan’s Kyushu Island, TSMC is etching a new chapter in global chip production. The TSMC Kumamoto facility, operationalized through its wholly-owned subsidiary Japan Advanced Semiconductor Manufacturing (JASM), represents the Taiwanese giant’s bold foray… Read More
Memory Matters: The State of Embedded NVM (eNVM) 2025
Make a difference and take this short survey. It asks about your experience with embedded non-volatile memory technologies. The survey is anonymous, and the results will be shared in aggregate to help the industry better understand trends: 2025 Embedded Non-Volatile Memory Survey.
We are now in the AI era where data is the lifeblood… Read More
Semidynamics Unveils 3nm AI Inference Silicon and Full-Stack Systems