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Experience in Multilayer High Density High-speed design with Mixed signals, Analog / Digital, RF and Flex PCBs.
Project requirements understanding, involve in High speed and High layer count PCB Design for complex circuit architectures / designs, Microstrip and strip line designs, stack-up designs
Experience in HDI(Blind/Buried), stacked, staggered, back drilling, Flex design, Rigid Flex, RF circuit boards, micro-via technology is a must.
Realize PCB designs with high electrical constraints, while balancing the competing needs of the electrical design with those of the manufacturing standards (DFM and DFT)
Must be strong in Mentor Graphics Expedition VX version, Altium Designer 23.x & Cadence Allegro 17.x.
Must have hands on experience in using and working on Allegro Design Entry HDL and Allegro PCB Designer.
Must have worked in High-Speed interfaces PCIEx Gen3/4/5, DDR Gen3/4/5, QSFP, FMC, HDMI, USB, Ethernet. (PCIe / DDR from these any one of the interfaces is must).
Must be strong in IPC standards Library footprint creation.
Very good work experience on Complex and multi-layer design (between 12 Layers to 26 Layers).
Must be used Back drill methodology in couple of designs.
Very good experience in DFx standards (DFM / DFA / DFT).
Must have working experience in Stacked and complex boards with high layer count.
Must have used HDI technology (Microvia (Laser via), Blind and Buried Vias) in couple of designs.
Must have knowledge in SI / PI analysis.
Must be strong in Constraints Driven methodology.
Strong experience in CAM350 Gerber validation tool.
Good Communication and Analytical skills.
Strong commitment to achieve the high quality of every task.
Adopt the new culture and work environment.
Self-driven, motivated and show high productivity in PCB design and development.
RISC-V Virtualization and the Complexity of MMUs