Wiki Tag: Samsung X-Cube

Samsung X-Cube™ (eXtended-Cube)

Samsung X-Cube™ (eXtended-Cube)
by Daniel Nenni on 07-16-2025 at 9:55 pm

Samsung X-Cube™ is a 3D IC packaging technology developed by Samsung Electronics that enables vertical stacking of multiple active logic dies using through-silicon vias (TSVs) and micro-bump bonding. As part of Samsung’s Advanced Package (AVP) portfolio—which also includes I-Cube™ (2.5D interposer-based packaging) and… Read More

IC Packaging Comparison Wiki (TSMC, Intel, Samsung)

IC Packaging Comparison Wiki (TSMC, Intel, Samsung)
by Daniel Nenni on 07-12-2025 at 4:03 pm

Why advanced packaging matters:

As Moore’s Law slows down, it has become increasingly difficult and expensive to scale monolithic SoCs. This has driven the semiconductor industry toward heterogeneous integration, which combines different functional blocks (CPU, GPU, memory, accelerators, etc.) in a single package… Read More