Samsung X-Cube™ (eXtended-Cube)

Samsung X-Cube™ (eXtended-Cube)
by Daniel Nenni on 07-16-2025 at 9:55 pm

Samsung X-Cube™ is a 3D IC packaging technology developed by Samsung Electronics that enables vertical stacking of multiple active logic dies using through-silicon vias (TSVs) and micro-bump bonding. As part of Samsung’s Advanced Package (AVP) portfolio—which also includes I-Cube™ (2.5D interposer-based packaging) and… Read More