Chips, packages and circuit boards (systems, hence CPS) used to be three separate domains with their own tools that barely interacted at all. If you were lucky, reassigning a pin on a package wouldn’t have to be done manually in all 3 places. But now, from a signal integrity, noise, power point of view these three domains must… Read More
Semiconductor Digital Twin Workshop (hosted by the SEMI Smart Manufacturing Initiative)
Join us for a 2-day deep dive into the expanding world of Digital Twin (DT) technology in the semiconductor realm. Understand its potential challenges and opportunities and discover its transformative power in enhancing operational productivity and quality. Calling all DT developers and end-users: collaborate, learn, and… Read More