In a keynote at the 62nd Design Automation Conference (DAC) on July 8, 2025, William Chappell, Vice President of Mission Systems at Microsoft, reflected on the intertwined evolution of AI and semiconductor design. Drawing from his DARPA experience, Chappell traced AI’s progression from 2016 onward, highlighting its… Read More
Tag: William Chappell
Intel Foundry Services Puts PDKs in the Cloud
Intel announced today that they are partnering with cloud and EDA companies to better enable their foundry business. This is a natural extension of the Accelerator ecosystem program announced earlier. More and more chip designs are being done in the cloud and from my experience cloud based designs are better. Some companies use… Read More
What to expect at the 58th DAC this December
I’ve attended the DAC conference and trade show since the late 1980s, and every visit has been a continuing learning experience about the EDA, IP and semiconductor industry. I first started attended as an EDA vendor in 1987, and since 2004 as a freelance marketing professional. There’s a significant amount of preparation… Read More