SoC designers have hit the memory wall head on. Although most SoCs address a relatively small memory capacity compared with PC and server chips, memory power consumption and bandwidth are struggling to keep up with processing and content expectations. A recent webinar looks at HBM as a possible solution.… Read More
Tag: through silicon via
Hybrid Memory Cube Shipping
Today Micron announced that it is shipping 2GB Hybrid Memory Cube (HMC) samples. The HMC is actually 5 stacked die connected with through-silicon-vias (TSVs). The bottom die is a logic chip and is actually manufactured for Micron in an IBM 32nm process (and doesn’t have any TSVs). The other 4 die are 4Gb DRAM die manufactured… Read More
SEMICON Taiwan 3D
SEMICON Taiwan is September 3rd to 6th in TWTC Nangang Exhibition Hall. Just as with Semicon West in July in San Francisco, there is lots going on. But one special focus is 3D IC. There is a 3DIC and substrate pavilion on the exhibit floor and an Advanced Packaging Symposium. Design tools, manufacturing, packaging and testing solutions… Read More