Join the Multi-die IC session on April 21 at EDPS 2016 in Monterey, CA

Join the Multi-die IC session on April 21 at EDPS 2016 in Monterey, CA
by Herb Reiter on 04-14-2016 at 12:00 pm

Following Moore’s Law down to 10 or even 7 nm labeled feature size demands US $ hundreds of millions of up-front investment, a very large design team and two or more years of development time. These parameters suggest that it only makes sense for very high volume applications to continue on the shrink path to increase SoCs’ functionalities.… Read More