Access to advanced semiconductor technology involves much more than choosing a process node. Design teams also need computing capacity, compatible tools, secure technology access, and experienced support. IC-Link by imec’s expanded collaboration with TSMC addresses that combination, potentially making sophisticated… Read More
At the 2026 OIP Ecosystem Forum, the industry narrative shifted from incremental scaling to what TSMC defines as the “Intelligence Revolution.” Akin to the 18th-century Industrial Revolution which transitioned human physical labor to mechanical power, the current era is augmenting human ingenuity through … Read More
It’s that time of year again. Time certainly flies when AI is chasing you! This year marks the 18th TSMC OIP Ecosystem Forum, and it promises to be bigger and better than ever. My SemiWiki partners, Mike Gianfagna and Kalar Rajendiran, will join me in covering the event live, so stay tuned for all the news that’s fit to print.
Mike and… Read More
Advanced semiconductor packaging has become essential to improving computing performance as conventional transistor scaling grows more difficult and expensive. Instead of manufacturing an entire processor as one large monolithic die, chipmakers can divide it into smaller chiplets and combine logic, memory, input/output… Read More
TSMC’s latest Board of Directors capital appropriation announcement may appear mixed on the surface, but a closer look reveals one important conclusion: The company is quietly setting the stage for another potential upward revision to its already aggressive 2026 capital expenditure outlook. The headline figure of $31.3B … Read More
L.C. leads efforts in design enablement, ensuring that the company can meet the diverse and evolving requirements of its global customer base. Prior to this, he headed the Design and Technology Platform organization starting in 2018.
Since joining TSMC in 2000, Dr. Lu has held multiple leadership positions in design services.… Read More
Yes, it is that time of year again, the 2026 TSMC Technology Symposium kick-off event in Silicon Valley. TSMC has never been in a better position to forecast the future of semiconductor technology and the industry itself. TSMC closely collaborates with the top semiconductor companies around the world and the top players in the … Read More
The main program for the 70th IEDM opened on Monday morning in San Francisco with an excellent keynote from Dr. Yuh-Jier Mii, Executive Vice President and Co-Chief Operating Officer at TSMC. Dr. Mii joined TSMC in 1994. Since then, he has contributed to the development and manufacturing of advanced CMOS technologies in both fab
At the recent TSMC OIP Ecosystem Forum in Santa Clara, there was an important presentation that laid the groundwork for a great deal of future innovation. Alchip and its IP and EDA partner Synopsys presented Efficient 3D Chiplet Stacking Using TSMC SoIC. The concept of 3D, chiplet-based design certainly isn’t new. SemiWiki maintains… Read More
Synopsys made significant announcements during the recent TSMC OIP Ecosystem Forum, showcasing a range of cutting-edge solutions designed to address the growing complexities in semiconductor design. With a strong emphasis on enabling next-generation chip architectures, Synopsys introduced both new technologies and … Read More
