By Jeff Wilson, Mentor Graphics and Anderson Chiu, TSMC
At this year’s TSMC Open Innovation Platform® (OIP) Ecosystem Forum, Mentor Graphics and TSMC co-presented some results of the ECO Fill flow developed for TSMC customers working at advanced nodes. Here is a summary of the presentation. (TSMC customers can access the presentation… Read More
Tag: smartfill
How ST-Ericsson Improved DFM Closure using SmartFill
DFM closure is a growing issue these days even at the 45nm node, and IC designers at ST-Ericsson have learned that transitioning from dummy fill to SmartFill has saved them time and improved their DFM score.
The SOC
ST-Ericsson designed an SOC for mobile platforms called the U8500 and their foundry choice was a 45nm node at STMicroelectronics… Read More