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I am tracking the shift to multi-die design, so it’s good to see Arteris extend their NoC expertise, connecting chiplets across an interposer. After all, network connectivity needs don’t stop at the boundaries of chiplets. A multi-die package is at a logical level just a scaled-up SoC for which you still need traffic routing and… Read More
Dan is joined by Rick Bye, director of product management and marketing at Arteris with responsibility for the FlexNoC family of non-coherent Network-on-Chip IP products. Rick joined Arteris from Arm where he was a senior product manager in the Client Line of Business, responsible for a demonstration SoC and compression IP. … Read More
