AI System Connectivity for UCIe and Chiplet Interfaces Demand Escalating Bandwidth Needs

AI System Connectivity for UCIe and Chiplet Interfaces Demand Escalating Bandwidth Needs
by Kalar Rajendiran on 05-27-2024 at 10:00 am

Alphwave Semi UCIe PHY Support for All Package Types

Artificial Intelligence (AI) continues to revolutionize industries, from healthcare and finance to automotive and manufacturing. AI applications, such as machine learning, deep learning, and neural networks, rely on vast amounts of data for training, inference, and decision-making processes. As AI algorithms become … Read More


Navigating the System-in-a-Package Manufacturing Ecosystem

Navigating the System-in-a-Package Manufacturing Ecosystem
by Mitch Heins on 10-26-2017 at 12:00 pm

Being an old ASIC physical design guy, I tend to think of ASICs from a “bond-pads-in” perspective. This week however, I had a very eye-opening discussion with Dan Leung, Director of Packaging and Assembly for Open-Silicon, that totally changed my perspective. While I had been exposed many times to the concept of systems-in-a-package… Read More