Leveraging Simulation to Accelerate the Design of Plasma Reactors for Semiconductor Etching Processes

Leveraging Simulation to Accelerate the Design of Plasma Reactors for Semiconductor Etching Processes
by Kalar Rajendiran on 06-03-2022 at 6:00 am

Etching Processes

There is no shortage of reporting on the many technological advances happening within the semiconductor industry. But sometimes it feels like we hear less in the area of semiconductor manufacturing equipment than in the design and product arenas. That doesn’t mean that there is less happening there or what is happening there … Read More


The Mechanical Reliability of IC Packages

The Mechanical Reliability of IC Packages
by Daniel Payne on 01-31-2016 at 12:00 pm

At Intel back in the late 1970’s we were designing DRAM chips and mounting them in ceramic and plastic packages, however there were problems when some of the die would crack inside of the package because of thermal mismatch issues with how the die was attached to the heat spreader inside the package. Back then we really didn’t… Read More