It’s Better than SUPREM for 3D TCAD

It’s Better than SUPREM for 3D TCAD
by Daniel Payne on 12-06-2016 at 12:00 pm

Process and device engineers have a tough task to model and simulate an IC process prior to fabricating silicon, however this approach is much better than the alternative choice in the 1970’s of just running multiple lots of wafers and then making measurements to see if your node was meeting specifications. Out of Stanford… Read More


It’s Time to Put Your Spice Netlists on a Diet

It’s Time to Put Your Spice Netlists on a Diet
by Tom Dillinger on 06-28-2016 at 7:00 am

Spice circuit simulation remains the backbone of IC design validation. Digital cell library developers rely upon Spice for circuit characterization, to provide the data for Liberty models. Memory IP designers utilize additional Spice features to perform statistical sampling. Analog and I/O interface designers extend these… Read More


My #53DAC Must See List!

My #53DAC Must See List!
by Daniel Nenni on 06-04-2016 at 7:00 am

It may be hard to believe but this happens to be my thirty third Design Automation Conference. Where does the time go? Three of my kids are out of college and the last one is getting close. That is where my time has gone. The conference itself started in 1964 but my first one was in 1984 in Albuquerque, New Mexico. In fact, that was the year… Read More


The Importance of Transistor-Level Verification

The Importance of Transistor-Level Verification
by Students@olemiss.edu on 04-10-2016 at 7:00 am

According to the IEEE Std 1012-2012, verification is the acknowledgement that a product is in satisfactory condition by meeting a set of rigorous criteria. [3] Transistor-level verification involves the use of custom libraries and design models to achieve ultimate performance, low power, or layout density. [2] Prediction… Read More


3D TCAD Simulation of Silicon Power Devices

3D TCAD Simulation of Silicon Power Devices
by Daniel Payne on 04-07-2016 at 12:00 pm

Process and device engineers are some of the unsung heroes in our semiconductor industry that have the daunting task of figuring out how to actually create a new process node that will fit some specific, market niche with sufficient yield to make their companies profitable and stand out from the competition. One such market segment… Read More


Custom IC Design Flow with OpenAccess

Custom IC Design Flow with OpenAccess
by Daniel Payne on 03-18-2016 at 12:00 pm

Imagine being able to use any combination of EDA vendor tools for schematic capture, SPICE circuit simulation, layout editing, place & route, DRC, LVS and extraction. On the foundry side, how about creating just a single Process Development Kit (PDK), instead of vendor-specific kits. Well, this is the basic premise of a recent… Read More


IC Design and OpenAccess

IC Design and OpenAccess
by Daniel Payne on 03-06-2016 at 12:00 pm

EDA vendors have long used proprietary file and database formats to keep their users locked into their specific tool flow and keep any competitors from sharing in the IC design process. Along the way the actual users of EDA tools have often requested and helped to create interoperable flows so that they could mix and match multiple… Read More


Variation Aware FinFETs are Critical!

Variation Aware FinFETs are Critical!
by Daniel Nenni on 12-18-2015 at 4:00 pm

As I mentioned in “EDA Dead Pool” acquisitions in our industry will continue at a rapid pace. The latest victim is 10 year old French company Infiniscale who was recently purchased by Silvaco. This was more of a “let’s put your product through our massive sales and support channel” kind of deal so it will be 1 + 1 = 3 accretive for sure.… Read More


Academia and TCAD Grow Closer

Academia and TCAD Grow Closer
by Daniel Payne on 12-02-2015 at 12:00 pm

On my first trip to Austria for EDA business I traveled by car from Germany, and I couldn’t wait to see how fast we would travel on the fabled Autobahn. Oddly enough it was summertime and the Autobahn was filled with vacationing families driving cars with shiny, aluminum campers in tow, so our car only traveled about 60 mph, nothing… Read More


Learning about 3D Integration of ICs and Systems

Learning about 3D Integration of ICs and Systems
by Daniel Payne on 10-15-2015 at 4:00 pm

We blog a lot about Moore’s Law, and even “More than Moore” where 3D integration of ICs and systems are used to get lower product costs. One big challenge with 3D integration of ICs is that most EDA software was really intended only for abstracting at 2D or 2.5D structures. Over the past several years there have … Read More