Heterogeneous Chiplets Design and Integration

Heterogeneous Chiplets Design and Integration
by Kalar Rajendiran on 05-28-2021 at 6:00 am

Transistor Cost per Billion 3nm Projection

Over the recent years, the volume and velocity of discussions relating to chiplets have intensified. A major reason for this is the projected market opportunity. According to research firm Omdia, chiplets driven market is expected to be $6B by 2024 from just $645M in 2018. That’s an impressive nine-fold projected increase over… Read More


Enabling Next Generation Silicon In Package Products

Enabling Next Generation Silicon In Package Products
by Kalar Rajendiran on 04-15-2021 at 10:00 am

System on Package Motivation AlphaWave IP

In early April, Gabriele Saucier kicked off Design & Reuse’s IPSoC Silicon Valley 2021 Conference. IPSoC conference as the name suggests is dedicated to semiconductor intellectual property (IP) and IP-based electronic systems. There were a number of excellent presentations at the conference. The presentations had been… Read More