Webinar – The Path to Smaller, Denser, and Faster with CPX, Samtec’s Co-Packaged Copper and Optics

Webinar – The Path to Smaller, Denser, and Faster with CPX, Samtec’s Co-Packaged Copper and Optics
by Mike Gianfagna on 10-02-2025 at 10:00 am

Webinar – The Path to Smaller, Denser, and Faster with CPX, Samtec’s Co Packaged Copper and Optics

For markets such as data center, high-performance computing, networking and AI accelerators the battle cry is often “copper is dead”. The tremendous demands for performance and power efficiency often lead to this conclusion. As is the case with many technology topics, things are not always the way they seem. It turns out a lot … Read More


Achieving Seamless 1.6 Tbps Interoperability for High BW HPC AI/ML SoCs: A Technical Webinar with Samtec and Synopsys

Achieving Seamless 1.6 Tbps Interoperability for High BW HPC AI/ML SoCs: A Technical Webinar with Samtec and Synopsys
by Daniel Nenni on 04-17-2025 at 10:00 am

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HPC Bandwidth Explosion and 1.6T Ecosystem Interop Need

The exponential growth in data bandwidth requirements driven by HPC systems, AI, and ML applications has set the stage for an ever-increasing need for 1.6Tbps Ethernet. As data centers strive to manage vast data transfers with maximum efficiency, the urgency for interoperability… Read More


2025 Outlook with Matt Burns of Samtec

2025 Outlook with Matt Burns of Samtec
by Daniel Nenni on 01-09-2025 at 10:00 am

Matt Burns Samtec

My good friend Matthew Burns develops go-to-market strategies for Samtec’s Silicon-to-Silicon solutions. Over the course of 25 years, he has been a leader in design, applications engineering, technical sales and marketing in the telecommunications, medical and electronic components industries. Matt holds a B.S. in Electrical… Read More


Samtec Welcomes You to the Future with Proven 224G PAM4 Interconnect Solutions

Samtec Welcomes You to the Future with Proven 224G PAM4 Interconnect Solutions
by Mike Gianfagna on 12-18-2023 at 8:00 am

Samtec Welcomes You to the Future with Proven 224G PAM4 Interconnect Solutions

We all know about the relentless march of Moore’s Law. Denser, faster, and cheaper semiconductor devices that fuel the innovations that surround us. For this discussion, I will lump the significant movement from single chip advances to multi-chip strategies into a single thread as devices continue to get smaller, faster and … Read More