Teradyne and TSMC: Pioneering the Future of Semiconductor Testing Through the 2025 OIP Partner of the Year Award

Teradyne and TSMC: Pioneering the Future of Semiconductor Testing Through the 2025 OIP Partner of the Year Award
by Daniel Nenni on 10-06-2025 at 10:00 am

TSMC 3D Fabric Packaging TSMC OIP 2025

In a significant milestone for the semiconductor industry, Teradyne was honored as the 2025 TSMC Open Innovation Platform® Partner of the Year for TSMC 3DFabric® Testing. This award, announced on September 25, 2025, underscores the deep collaboration between Teradyne, a leader in automated test equipment and robotics, and… Read More