A 25th Anniversary Celebration
Escape the winter and celebrate 25 years of innovation with us at The Wigwam Arizona Resort in Phoenix, AZ.
FLEX—Technology Summit is a vibrant networking event designed to foster community building. … Read More
January 22-23, 2026, hosted by SEMI International, Silicon Valley, CA USA
Note: HBS’26 is a hybrid event, with both in-person and virtual participation via WebEx.
Download the Call for Presentations!
Hybrid Bonding has emerged as the technology of choice in the semiconductor and heterogeneous integration industries for … Read More
Join us at the Ritz-Carlton in Half Moon Bay, CA to get the latest insights on economic trends, market drivers, geopolitics, technology, and what these will mean for the near future to help drive your business forward. The cooperative platform of ISS and its tremendous collective assets will serve to help power your strategies … Read More
Join us for a webinar that will explore the role of SEMI’s Public Policy and Advocacy (PP&A) team in driving policy developments that are relevant to the ESDA community. PP&A staff will present on SEMI’s advocacy efforts, how you can interface with our team in DC, and how we work with member companies to advance key legislative… Read More
SEMI IESA India is committed to accelerating the growth and innovation of India’s semiconductor and electronics manufacturing ecosystem. As part of the global SEMI organization, we bring together industry leaders, innovators, academia, government and other stakeholders
Gain a comprehensive understanding of the semiconductor industry and the integrated circuit (IC) manufacturing process. This course is designed for new personnel in the field or anyone seeking a well-rounded knowledge of the tools, materials, and terminology used in semiconductor manufacturing.
Early Bird Special!… Read More
Embark on a journey through semiconductor design, manufacturing, and business in this illuminating course. Explore IC design techniques, transistor evolution, and market dynamics. Delve into substrate types and industry economics, discovering the fastest-growing markets and key players shaping the semiconductor landscape.… Read More
Chiplet and heterogeneous integration of packaging has been embraced as the next revolutionary innovation to meet the quest of size, cost, and performance for packaging. The technologies are seen as another disruptive technology to bring devices into a package by integrating the various Multi-chip module (MCM), 3D packaging,
This course discusses the fundamentals of plasma assisted phenomena and reactive ion etching (RIE) processes. The emphasis is on the physical and chemical processes that determine the consequences of a reactive gas plasma/surface interaction. The role of energetic ions as encountered in RIE systems is discussed in detail … Read More
Discover how the latest MEMS and imaging technologies are enabling next-level value creation across industries. Explore cutting-edge AI-enhanced sensing, data fusion, and their transformative impact on automotive, healthcare, and smart systems. Learn how these technologies are driving Europe’s leadership in … Read More
