The semiconductor industry is rapidly moving beyond traditional 2D packaging, embracing technologies such as 3D integrated circuits (3D ICs) and 2.5D advanced packaging. These approaches combine heterogeneous chiplets, silicon interposers, and complex multi-layer routing to achieve higher performance and integration.… Read More
Tag: scalable
FineSim Webinar
FineSim is Magma’s circuit simulator that has been doing extraordinarily well. In my opinion it is one of the big reasons that Synopsys is acquiring (presumably, still subject to approval of course) Magma. FineSim is especially strong in the memory market with over 70% of the top 5 DRAM manufacturers and the top 10 flash manufacturers… Read More