From the multi-chip-modules (MCM) of yester years to today’s System-in-Package (SiP) implementations, things have progressed a lot in terms of package technology. The chiplet movement is not only a big beneficiary of today’s advanced package technologies but drives further advances in this technology area. While a chiplets-based… Read More
Tag: proteantecs
proteanTecs Technology Helps GUC Characterize Its GLink™ High-Speed Interface
An earlier post on SemiWiki discussed how deep data analytics helps accelerate SoC product development. The post presented insights into proteanTecs’ technology and quantified the benefits that can be derived by leveraging the software platform for SoC product development. You can review that earlier blog here. The power … Read More
Webinar: The Era of Chiplets and Heterogeneous Integration: Challenges and Emerging Solutions to Support 2.5D and 3D Advanced Packaging
November 16, 2022 | 9:00 AM PT | 12:00 PM ET | 6:00 PM CET
(A recording will be sent after the live event to all registrants)
The era of chiplets and heterogeneous integration is here. High-end performance packaging will be a $7.87 billion market by 2027, with a 19% CAGR.1
As the semiconductor industry adopts chiplets and heterogeneous… Read More
Elevating Production Testing with proteanTecs and Advantest’s ACS Edge™ Platforms
SemiWiki recently posted a blog on “Deep Data Analytics for Accelerating SoC Product Development.” That blog focused on proteanTecs’ AI-enabled chip analytics platform that helps accelerate SoC product development. The blog provided insight into proteanTecs’ approach and shared quantifiable business-impact metrics … Read More
How Deep Data Analytics Accelerates SoC Product Development
Ever since the birth of the semiconductor industry, advances have always been at a fast pace. The complexity of SoCs have grown along the way, driven by the demanding computational and communication needs of various market applications. Over the last decade, the growth in complexity has accelerated at unforeseen rates, fueled… Read More
Second IEEE International Workshop on SLM (Silicon Lifecycle Management)
HYBRID FORMAT
SEPTEMBER 29-30, 2022
AIM OF THE WORKSHOP
With increasing system complexity, security, stringent runtime requirements for functional safety, and cost constraints of a mass market, the reliable and secure operation of electronics in safety- critical, enterprise servers and cloud computing domains is still … Read More
CEO Interview: Shai Cohen of proteanTecs
Shai Cohen is an entrepreneur and industry veteran, with vast experience in building technology companies from the ground up. He is a co-founder and CEO of proteanTecs, which develops revolutionary Universal Chip Telemetry™ for electronic systems throughout their entire lifecycle. Prior to founding proteanTecs, Shai co-founded… Read More
The Changing Landscape of Automotive Electronics
The automotive industry is undergoing a seismic shift. Supply chain constraints, software defined architectures, functional safety requirements, and the changing dynamics between OEMs, Tier 1s and semiconductor companies, are driving the industry to seek innovative ways to approach new challenges.
Join us on Tuesday,