Webinar: EMX Planar 3D Solver – Key New Features and Updates

Webinar: EMX Planar 3D Solver – Key New Features and Updates
by Admin on 06-10-2025 at 3:17 pm

Webinar Details

The increasing complexity of chip designs that leverage 3D-IC technology, heterogeneous integration, and other manufacturing advancements, emphasizes the need for accurate modeling of electromagnetic (EM) crosstalk. EM solvers continue to play a key role in solving larger problems both in terms of layout

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Will the Apple A9 Fall Flat?

Will the Apple A9 Fall Flat?
by Robert Maire on 01-23-2015 at 12:00 pm

Several months ago we had suggested that we were concerned that Apple’s A9 processor would wind up being 20nm planar (maybe 14nm planar) rather than the expected 14nm FinFET. As we are now under 9 months from a likely launch time for Apple’s next gen IPhone the timing for getting a 14nm FinFET processor on board the phoneRead More


ISSCC: Analog-Digital Converter in FD-SOI

ISSCC: Analog-Digital Converter in FD-SOI
by Paul McLellan on 02-20-2014 at 11:50 am

The International Solid-State Circuits Conference (ISSCC) was last week in San Francisco. Stéphane Le Tual, Pratap Narayan Singh, Christophe Curis, Pierre Dautriche, all from STMicroelectronics presented a paper on A 20GHz-BW 6b 10GS/s 32mW Time-Interleaved SAR ADC with Master T&H in 28nm UTBB FDSOI TechnologyRead More