By Ujjwal Negi – Siemens EDA
Multi-die architectures are redefining the limits of chip performance and scalability through the integration of multiple dies into a single package to deliver unprecedented computing power, flexibility, and efficiency. At the heart of this transformation is the Universal Chiplet Interconnect… Read More
AI explosion is clearly driving semi-industry since 2020. AI processing, based on GPU, need to be as powerful as possible, but a system will reach optimum only if it can rely on top interconnects. The various sub-system need to be interconnected with ever more bandwidth and lower latency, creating the need for ever advanced protocol… Read More
Keysight, with deep roots tracing back to Hewlett-Packard, has long been at the forefront of innovation in electronic design and testing. It manufactures electronics test and measurement equipment and software. The company also owns its own foundry and makes custom chips and packages for its instrumentation business. Many… Read More
In today’s digital landscape, data security has become an indispensable feature for any data transfer protocol, including Peripheral Component Interconnect Express (PCIe). With the rising frequency and sophistication of digital attacks, ensuring data integrity, confidentiality, and authenticity during PCIe transport… Read More
AI is exploding everywhere. We’ve all seen the evidence. The same thing is happening with AI conferences. The conference I will discuss here began in 2018 as the AI Hardware Summit. The initial venue was the Computer History Museum in Mountain View, CA. Like most things AI, this conference has grown substantially in a relatively… Read More
The annual ITC event is happening this week in San Diego as semiconductor test professionals gather from around the world to discuss their emerging challenges and new approaches, so last week I had the opportunity to get an advance look at something new from Siemens named Tessent In-System Test software. Jeff Mayer, Product Manager,… Read More
As the demand for higher performance computing solutions grows, so does the need for faster, more efficient data communication between components in complex multi-die system-on-chip (SoC) designs. In response to these needs, Synopsys has introduced the world’s fastest UCIe-based IP solution, capable of operating at a groundbreaking… Read More
Wendy Chen, MBA from the University of Manchester, has been the Founder and CEO of MSquare Technology since 2021. With over 23 years in the semiconductor industry, Wendy’s career includes roles as Sales Director at Synopsys Technology, Vice President at TF-AMD, and Vice President at Alchip Asia Pacific. Her extensive experience… Read More
The semiconductor industry is experiencing a significant transformation with the advent of chiplet design, a modular approach that breaks down complex chips into smaller, functional blocks called chiplets. A chiplet-based design approach offers numerous advantages, such as improved performance, reduced development … Read More
In the rapidly evolving landscape of high-performance computing (HPC) and artificial intelligence (AI), the demand for increased processing power, efficiency, and scalability is ever-growing. Traditional monolithic chip designs are increasingly unable to keep pace with these demands, leading to the emergence of chiplets… Read More
