FinFET Reliability Analysis with Device Self-Heating

FinFET Reliability Analysis with Device Self-Heating
by Tom Dillinger on 10-22-2015 at 12:00 pm

At the recent TSMC OIP symposium, a collaborative presentation by Synopsys and Xilinx highlighted the importance of incorporating the local FinFET device self-heating temperature increase on the acceleration of device reliability mechanisms.… Read More