Ensuring 3D IC Semiconductor Reliability: Challenges and Solutions for Successful Integration

Ensuring 3D IC Semiconductor Reliability: Challenges and Solutions for Successful Integration
by Kalar Rajendiran on 10-25-2023 at 10:00 am

3D IC Cross Section Illustration

One of the most promising advancements in the semiconductor field is the development of 3D Integrated Circuits (3D ICs). 3D ICs enable companies to partition semiconductor designs and seamlessly integrate silicon Intellectual Property (IP) at the most suitable process nodes and processes. This strategic partitioning yields… Read More


Balancing analog layout parasitics in MOSFET differential pairs

Balancing analog layout parasitics in MOSFET differential pairs
by Admin on 06-22-2022 at 1:25 pm

The MOSFET differential pair is a key part of many analog circuits e.g. opamps, comparators, LDOs, etc. A differential pair applies gain to the difference between two signals and has many advantages over single-ended amplifier circuits, e.g. noise reduction and suppression of common-mode signals and DC offset. However, these

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Effect of Inductance on Interconnect

Effect of Inductance on Interconnect
by Daniel Nenni on 03-02-2014 at 11:00 am

In previous design generations interconnect could safely be modeled by extraction using just R and C values. Parasitics in interconnect are important because they can affect the operating frequency or phase error in circuits like VCO’s. The need to model parasitics properly in wires is just as applicable in PA’s, LNA’s and for… Read More