Advanced Packaging Analysis at DesignCon

Advanced Packaging Analysis at DesignCon
by Tom Dillinger on 06-07-2022 at 10:00 am

meshing

The slogan for the DesignCon conference has been “where the chip meets the board”.  Traditionally, the conference has provided a breadth of technical presentations covering the design and analysis of high-speed communication interfaces and power integrity evaluations between chip, board, and system.

The recent DesignCon… Read More


Enabling Next Generation Silicon In Package Products

Enabling Next Generation Silicon In Package Products
by Kalar Rajendiran on 04-15-2021 at 10:00 am

System on Package Motivation AlphaWave IP

In early April, Gabriele Saucier kicked off Design & Reuse’s IPSoC Silicon Valley 2021 Conference. IPSoC conference as the name suggests is dedicated to semiconductor intellectual property (IP) and IP-based electronic systems. There were a number of excellent presentations at the conference. The presentations had been… Read More