FinFET & Multi-patterning Need Special P&R Handling

FinFET & Multi-patterning Need Special P&R Handling
by Pawan Fangaria on 04-28-2014 at 1:00 pm

I think by now a lot has been said about the necessity of multi-patterning at advanced technology nodes with extremely low feature size such as 20nm, because lithography using 193nm wavelength of light makes printing and manufacturing of semiconductor design very difficult. The multi-patterning is a novel semiconductor manufacturing… Read More


Macro Placement Challenges

Macro Placement Challenges
by Paul McLellan on 12-27-2013 at 7:28 pm

Image RemovedOne of the challenges of physical design of a modern SoC is that of macro placement. Back when a design just had a few macros then the flooplanning could be handled largely manually. But modern SoCs suffer from a number of problems. A new white paper from Mentor covers Olympus-SOCs features to address these issues:

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Conquering the Big Data Challenges

Conquering the Big Data Challenges
by Beth Martin on 04-02-2012 at 4:38 pm

Extrapolating the trends from last 20 years to the next ten suggests that we will be implementing a trillion transistors or more by 2020. At 20nm, with the chip sizes touching billions of transistors, the age old problem of how to implement a design in the most efficient manner remains unanswered.

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