The Intelligence Revolution: TSMC’s OIP Ecosystem Forges the Path to Trillion-Transistor AI Systems

The Intelligence Revolution: TSMC’s OIP Ecosystem Forges the Path to Trillion-Transistor AI Systems
by Kalar Rajendiran on 09-23-2026 at 2:00 pm

Broadest Portfolio of Silicon Validated IP

At the 2026 OIP Ecosystem Forum, the industry narrative shifted from incremental scaling to what TSMC defines as the “Intelligence Revolution.” Akin to the 18th-century Industrial Revolution which transitioned human physical labor to mechanical power, the current era is augmenting human ingenuity through … Read More


Revolutionizing Chip Packaging: The Impact of Intel’s Embedded Multi-Die Interconnect Bridge (EMIB)

Revolutionizing Chip Packaging: The Impact of Intel’s Embedded Multi-Die Interconnect Bridge (EMIB)
by Admin on 08-27-2025 at 10:00 am

Intel Foundry Packaging Evolution 2025

In an era dominated by artificial intelligence (AI), machine learning (ML), and high-performance computing (HPC), the demand for semiconductors that deliver high data throughput, low latency, and energy efficiency has never been greater. Traditional chip designs often struggle to keep pace with these requirements, leading… Read More


A “Super” Technology Mid-life Kicker for Intel

A “Super” Technology Mid-life Kicker for Intel
by Tom Dillinger on 08-17-2020 at 10:00 am

TigerLake WillowCove

Summary
At the recent Intel Architecture Day 2020 symposium, a number of technology enhancements to the Intel 10nm process node were introduced.  The cumulative effect of these enhancements would provide designs with a performance boost (at iso-power) approaching 20% – a significant intra-node enhancement, to be sure.  The… Read More