Tag: microelectronics

Webinar: Advanced Packaging and Material Characterization for Microelectronics: SEMI Training

Webinar: Advanced Packaging and Material Characterization for Microelectronics: SEMI Training
by Admin on 10-22-2025 at 4:04 am

Strengthen your knowledge and skills by learning about new packaging technologies in Fan-in, Fan-out WLP, Embedded packaging technology, System on Chip (SOC), System in Package (SiP), 3D IC, WLP, TSV, etc. Packaging knowledge is a must for professionals in the semiconductor industry. The first part of this course dives deep

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IRPS 2026

IRPS 2026
by Admin on 08-27-2025 at 10:43 pm

About IRPS

For over 60 years, IRPS has been the premiere conference for engineers and scientists to present new and original work in the area of microelectronics reliability. Drawing participants from the United States, Europe, Asia, and all other parts of the world, IRPS seeks to understand the reliability of semiconductor … Read More

The 25th European Microelectronics & Packaging Conference (EMPC 2025)

The 25th European Microelectronics & Packaging Conference (EMPC 2025)
by Admin on 08-27-2025 at 9:09 pm

EMPC 2025 is the 25th European Microelectronics & Packaging Conference, an international event for microelectronics packaging, assembly, and interconnection technologies, taking place in Grenoble, France, from September 16–18, 2025. The conference focuses on advanced packaging, new materials, power electronics,… Read More

Chiplet and Heterogeneous Integration for Microelectronics Packaging – Virtual Training

Chiplet and Heterogeneous Integration for Microelectronics Packaging – Virtual Training
by Admin on 07-18-2025 at 9:49 am

Chiplet and heterogeneous integration of packaging has been embraced as the next revolutionary innovation to meet the quest of size, cost, and performance for packaging. The technologies are seen as another disruptive technology to bring devices into a package by integrating the various Multi-chip module (MCM), 3D packaging,

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TI’s Way of Strategies – Formation & Execution

TI’s Way of Strategies – Formation & Execution
by Pawan Fangaria on 02-26-2014 at 8:30 am
Categories: EDA, Foundries, General

For a company to stand still and continually prosper even after facing several downturns in its career of 80+ years, and still move swiftly with strong commitment and confidence, its strategy has to be right and rock solid possessing sustainable competitive advantage, and of course it has to be an early mover in everything it does… Read More