For a company to stand still and continually prosper even after facing several downturns in its career of 80+ years, and still move swiftly with strong commitment and confidence, its strategy has to be right and rock solid possessing sustainable competitive advantage, and of course it has to be an early mover in everything it does… Read More
Webinar: Advanced Packaging and Material Characterization for Microelectronics: SEMI Training
Strengthen your knowledge and skills by learning about new packaging technologies in Fan-in, Fan-out WLP, Embedded packaging technology, System on Chip (SOC), System in Package (SiP), 3D IC, WLP, TSV, etc. Packaging knowledge is a must for professionals in the semiconductor industry. The first part of this course dives deep