Deep-ultraviolet (DUV) immersion lithography remains a critical patterning technology for advanced semiconductor manufacturing. Using a 193 nm ArF exposure system with water between the projection lens and wafer, immersion lithography increases numerical aperture and enables smaller features than dry exposure. However,… Read More
The relentless miniaturization of semiconductor devices has always relied on achieving ever-smaller features on silicon wafers. However, as the industry enters the realm of extreme ultraviolet (EUV) lithography, it faces a critical barrier: stochastics, or the inherent randomness in patterning at atomic scales. This phenomenon… Read More
It’s a classic and creative example of design and EDA tool community getting together, exploiting tool capabilities and developing flows which add value to all stake holders including the end consumer. We know power has become extremely important for battery life in smart phones, high performance servers, workstations, notebooks… Read More
