Sign Off Design Challenges at Cutting Edge Technologies

Sign Off Design Challenges at Cutting Edge Technologies
by Tom Simon on 12-03-2020 at 6:00 am

Power and Ground Design Challenges

As semiconductor designs for many popular products move into smaller process nodes, the need for effective and rapid design closure is increasing. The SOCs used for many consumer and industrial applications are moving to FinFET nodes from 16 to 7nm and with that comes greater challenges in obtaining design closure. einfochips,… Read More